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<p>With the advancement of electronic technology, electronic products have increasingly been deployed in a variety of demanding environments, such as high temperatures and corrosive liquids. This study investigated the microstructure, corrosion resistance and tensile properties of Sn–3.0Ag–0.5Cu (SAC305) solder alloy aged at 150&#xa0;°C for maximum time of 240&#xa0;h. The results indicated that aging treatment significantly affected the microstructure of the alloy. As the aging time increased, the coarsening of the microstructure became more pronounced, and the quantity of fine Ag<sub>3</sub>Sn particles gradually decreased. Electrochemical tests showed that the solder alloy aged for 24&#xa0;h exhibited the lowest corrosion current density, the largest Nyquist semicircle diameter, and the best corrosion resistance. However, a decline in the corrosion resistance of the solder was observed with further aging. Tensile testing revealed that the tensile strength of SAC305 decreased with increasing aging time, while the elongation was found to be improved. </p>

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Microstructure, corrosion and mechanical properties of Sn–3.0Ag–0.5Cu solder alloy aged at 150 °C

  • 期刊论文

  • 发表日期：

    2025年5月10日

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  • Wenjing Chen,
  • Bin Chen,
  • Xiaowu Hu

摘要

With the advancement of electronic technology, electronic products have increasingly been deployed in a variety of demanding environments, such as high temperatures and corrosive liquids. This study investigated the microstructure, corrosion resistance and tensile properties of Sn–3.0Ag–0.5Cu (SAC305) solder alloy aged at 150 °C for maximum time of 240 h. The results indicated that aging treatment significantly affected the microstructure of the alloy. As the aging time increased, the coarsening of the microstructure became more pronounced, and the quantity of fine Ag3Sn particles gradually decreased. Electrochemical tests showed that the solder alloy aged for 24 h exhibited the lowest corrosion current density, the largest Nyquist semicircle diameter, and the best corrosion resistance. However, a decline in the corrosion resistance of the solder was observed with further aging. Tensile testing revealed that the tensile strength of SAC305 decreased with increasing aging time, while the elongation was found to be improved.