Microstructure evolution and shear behavior of Pb-16Sn-7.5Sb-xAg/Ni joints
摘要
The Pb16Sn7.5Sb-based solder with a melting point of 240 °C can be used as an ideal candidate solder in this temperature range. The microstructure and shear strength of Pb16Sn7.5Sb-xAg/Ni solder joints after soldering for 2 ~ 60 min were investigated in present work. The Ni3Sn2 + NiSb phases formed at the interface of the Pb-16Sn-7.5Sb-xAg/Ni joints. The thickness of Ni3Sn2 + NiSb phases was proportional to the square root of time. However, the Ag addition increased the activation energy of the Ni3Sn2 and NiSb phases, which inhibited the rapid growth of the Ni3Sn2 and NiSb phases. Therefore, the thickness of Ni3Sn2 + NiSb phases of Pb16Sn7.5Sb-1Ag/Ni joint was 0.35 μm after soldering for 2 min, the shear strength of the joint can reach 25.9 MPa. The shear strength increased to 32.5 MPa when the thickness of the Ni3Sn2 + NiSb phase was 0.38 μm after 5 min soldering. It decreased to 23.5 MPa after prolonged the soldering time as the Ni3Sn2 + NiSb phase thickness increased. A uniform Ni3Sn2 + NiSb layer with adequate thickness is the key for the mechanical properties of the Pb-16Sn-7.5Sb-xAg/Ni.