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<p>Thermally stable thermoplastic elastomeric nanocomposites derived from poly(styrene-b-ethylene-ran-butylene-b-styrene)-grafted maleic anhydride; SEBS-g-MA were prepared using copper nanoparticles (Cu NPs), reduced graphene oxide (rGO), and carbon nanotubes (CNTs) as conductive nanofillers. The electrical conductivity was introduced in SEBS-g-MA, a triblock insulating polymer matrix, thus presenting a combination of conductivity and processability presenting a class of materials for conductive layers in electronic devices. Initial functional group analysis was carried out through FTIR, while XRD patterns confirmed the phase purity and incorporation of nanofillers effectively into the polymer matrix. Scanning electron micrographs depicted homogeneous nanofiller dispersion in the polymer matrix at lower filler proportions which tend to improve the mechanical and thermal characteristics. Conductive nanofillers incorporated the electrical conductivity in an insulating polymer system, depicting the better flow of electrons with a lower percentage of CNTs followed by rGO and Cu NPs. π–π interactions between polymer and CNTs/rGO facilitated electron transfer more effectively than Cu NPs. The decomposition temperature of the polymer was increased from 365&#xa0;°C for the pure polymer to 430, 489, and 432&#xa0;°C for Cu (4%), rGO (3%), and CNTs (3%), respectively. Similarly, while studying the mechanical properties, it was observed that Young’s modulus of the nanocomposites was increased with increasing amounts of nanofiller which is significantly dictated by the homogeneous dispersion and enhanced forces of interaction between reinforcement and matrix. Henceforth, the designed nanocomposites with enhanced conductive, thermal, and mechanical properties present a potential candidate to replace the pristine polymer systems with more durability in addition to conductivity. Agglomeration of nanofiller after an optimized proportion may lead to less pronounced improvement in thermal and mechanical resilience, thus better dispersion is to be ensured. These nanocomposites hold great promise for use in flexible electronics, electromagnetic interference (EMI) shielding materials, and next-generation wearable devices.</p>

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Nanofiller-induced conductivity, thermal and mechanical stability in SEBS-g-MA thermoplastic elastomeric nanocomposites

  • 期刊论文

  • 发表日期：

    2025年4月24日

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  • Manzar Zahra,
  • Haroon Ejaz,
  • Rajwali Khan,
  • Muhammad Tariq Qamar,
  • Qaisar Mehmood Saharan,
  • Jigar Ali,
  • Amir Waseem,
  • Iftikhar Ahmad,
  • Khaled Althubeiti,
  • Sherzod Abdullaev,
  • Shahid Iqbal

摘要

Thermally stable thermoplastic elastomeric nanocomposites derived from poly(styrene-b-ethylene-ran-butylene-b-styrene)-grafted maleic anhydride; SEBS-g-MA were prepared using copper nanoparticles (Cu NPs), reduced graphene oxide (rGO), and carbon nanotubes (CNTs) as conductive nanofillers. The electrical conductivity was introduced in SEBS-g-MA, a triblock insulating polymer matrix, thus presenting a combination of conductivity and processability presenting a class of materials for conductive layers in electronic devices. Initial functional group analysis was carried out through FTIR, while XRD patterns confirmed the phase purity and incorporation of nanofillers effectively into the polymer matrix. Scanning electron micrographs depicted homogeneous nanofiller dispersion in the polymer matrix at lower filler proportions which tend to improve the mechanical and thermal characteristics. Conductive nanofillers incorporated the electrical conductivity in an insulating polymer system, depicting the better flow of electrons with a lower percentage of CNTs followed by rGO and Cu NPs. π–π interactions between polymer and CNTs/rGO facilitated electron transfer more effectively than Cu NPs. The decomposition temperature of the polymer was increased from 365 °C for the pure polymer to 430, 489, and 432 °C for Cu (4%), rGO (3%), and CNTs (3%), respectively. Similarly, while studying the mechanical properties, it was observed that Young’s modulus of the nanocomposites was increased with increasing amounts of nanofiller which is significantly dictated by the homogeneous dispersion and enhanced forces of interaction between reinforcement and matrix. Henceforth, the designed nanocomposites with enhanced conductive, thermal, and mechanical properties present a potential candidate to replace the pristine polymer systems with more durability in addition to conductivity. Agglomeration of nanofiller after an optimized proportion may lead to less pronounced improvement in thermal and mechanical resilience, thus better dispersion is to be ensured. These nanocomposites hold great promise for use in flexible electronics, electromagnetic interference (EMI) shielding materials, and next-generation wearable devices.