<p> In packaging processes, gold wire is commonly used as bonding wire material. However, the price of gold wire has increased significantly in recent years, so silver and copper wires are mainly used as materials. The sulfur atoms and chloride ions present in the packaging adhesive can lead to corrosion and degradation over long-term exposure. To reduce costs while maintaining corrosion resistance, the study employs gold-silver alloy wires with increased proportion of silver to control costs and delay the formation of intermetallic compounds during wire applications. To investigate the electrical properties and corrosion resistance of gold-silver alloy wires, various heat treatment conditions and electrical fusing experiments were conducted. Subsequently, sulfurization tests were introduced to evaluate the wires’ resistance to sulfide corrosion. In terms of mechanical properties, pure gold wires exhibited excellent mechanical strength and hardness due to the fine grain size effect. Although electrical analysis showed that gold-silver alloy wires have higher resistivity than pure gold wires due to the alloying process, reducing the length of the wire minimizes electron travel distance, thus, bringing the resistivity of gold-silver alloy wires closer to that of pure gold wires. Sulfurization tests revealed that gold-silver alloy wire formed silver sulfide particle on the surface, leading to a significant increase in resistivity compared to pure gold wires, which ultimately reduces the fatigue life under electrical fatigue experiments. However, under short-term sulfurization conditions, the internal sulfurization of gold-silver alloy wires is relatively mild, maintaining both mechanical and electrical properties.</p>