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<p>The effects of In content on the microstructure and tensile property of Sn–6.5Zn–0.08S solder were studied. The optical micrographs showed that the microstructure of Sn–6.5Zn–0.08S–<i>x</i>In (<i>x</i> = 0, 1, 2, 4 and 5, in wt%) alloy consisted of Sn–Zn eutectic structure and β-Sn matrix. With the addition of In, a portion of Zn-rich phase in the eutectic structures was coarsened. The addition of In enhanced the tensile strength of the solder alloy from 62.1 to 72.5&#xa0;MPa when the In content varied from 0 to 5 wt% because of the solid solution of In and the formation of InSn<sub>4</sub>. The Sn–6.5Zn–0.08S–<i>x</i>In solder alloys presented a typical ductile fracture, and its ductility was improved with the addition of In. The EDS and XRD results showed that Cu<sub>5</sub>Zn<sub>8</sub> and CuZn intermetallic compounds were formed between Sn–6.5Zn–0.08S–<i>x</i>In and Cu substrate. In played an important role in the inhibition of the growth of IMC since the average thickness of IMC decreased from 7.15 to 6.12&#xa0;μm with In addition. This inhibition was also in effect during the aging process. The shear strength of the Cu/Sn–6.5Zn–0.08S–<i>x</i>In/Cu solder joints was increased to 47.8&#xa0;MPa when the In content was 5 wt%.</p>

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The role of indium in the microstructure and mechanical property of Sn–6.5Zn–0.08S solder

  • 期刊论文

  • 发表日期：

    2025年2月3日

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  • Huizhen Huang,
  • Zhufa Huang,
  • Gewang Shuai,
  • Yang Liu,
  • Xinyuan Yu

摘要

The effects of In content on the microstructure and tensile property of Sn–6.5Zn–0.08S solder were studied. The optical micrographs showed that the microstructure of Sn–6.5Zn–0.08S–xIn (x = 0, 1, 2, 4 and 5, in wt%) alloy consisted of Sn–Zn eutectic structure and β-Sn matrix. With the addition of In, a portion of Zn-rich phase in the eutectic structures was coarsened. The addition of In enhanced the tensile strength of the solder alloy from 62.1 to 72.5 MPa when the In content varied from 0 to 5 wt% because of the solid solution of In and the formation of InSn4. The Sn–6.5Zn–0.08S–xIn solder alloys presented a typical ductile fracture, and its ductility was improved with the addition of In. The EDS and XRD results showed that Cu5Zn8 and CuZn intermetallic compounds were formed between Sn–6.5Zn–0.08S–xIn and Cu substrate. In played an important role in the inhibition of the growth of IMC since the average thickness of IMC decreased from 7.15 to 6.12 μm with In addition. This inhibition was also in effect during the aging process. The shear strength of the Cu/Sn–6.5Zn–0.08S–xIn/Cu solder joints was increased to 47.8 MPa when the In content was 5 wt%.