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<p>Advancements in electronic packaging technology necessitate the use of materials that provide excellent electrical and thermal conductivity and high mechanical strength and durability. Sintering of Ag particles has emerged as a promising alternative to traditional Pb-based and Sn–Ag–Cu solders for chip attachment in electronic devices. This study explores the performance of Ag-coated Cu (Cu@Ag) particle-based pastes with varying particle sizes (0.8, 1.8, and 3.9&#xa0;μm) in bonding Si chips to Cu direct-bonded Cu (Cu DBC) substrates. Furthermore, this study investigates the effects of incorporating silane additives into the paste to enhance bonding strength and joint morphology. The findings indicate that smaller Cu@Ag particles result in stronger sintered joints owing to their lower void fraction and higher surface area. The addition of silane A significantly improves bonding strength and adhesion at an optimal concentration of 0.2 wt%. The findings contribute toward developing more reliable and efficient electronic packaging materials, particularly for optimizing the mechanical properties and stability of Cu@Ag-sintered joints.</p>

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Impact of particle size and additives on the sintering behavior of Cu@Ag pastes

  • 期刊论文

  • 发表日期：

    2025年2月4日

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  • Miso Won,
  • Dajung Kim,
  • Hyunseung Yang,
  • Chulmin Oh

摘要

Advancements in electronic packaging technology necessitate the use of materials that provide excellent electrical and thermal conductivity and high mechanical strength and durability. Sintering of Ag particles has emerged as a promising alternative to traditional Pb-based and Sn–Ag–Cu solders for chip attachment in electronic devices. This study explores the performance of Ag-coated Cu (Cu@Ag) particle-based pastes with varying particle sizes (0.8, 1.8, and 3.9 μm) in bonding Si chips to Cu direct-bonded Cu (Cu DBC) substrates. Furthermore, this study investigates the effects of incorporating silane additives into the paste to enhance bonding strength and joint morphology. The findings indicate that smaller Cu@Ag particles result in stronger sintered joints owing to their lower void fraction and higher surface area. The addition of silane A significantly improves bonding strength and adhesion at an optimal concentration of 0.2 wt%. The findings contribute toward developing more reliable and efficient electronic packaging materials, particularly for optimizing the mechanical properties and stability of Cu@Ag-sintered joints.