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<p>Thick-film resistors are one of the essential passive components in thick-film hybrid integrated circuit, often made from expensive RuO<sub>2</sub>-based paste. Herein, a resistor paste containing Ti<sub>3</sub>SiC<sub>2</sub> cermet and CaO-B<sub>2</sub>O<sub>3</sub>-SiO<sub>2</sub> (CBS) glass has been developed to prepare thick-film resistors. Ti<sub>3</sub>SiC<sub>2</sub> with excellent electrical conductivity and low cost was used as the conductive phase materials. CBS glass frits were prepared as inorganic binder phase. Ti<sub>3</sub>SiC<sub>2</sub>-based resistor pastes containing different contents of the glass frit were sintered on alumina substrate at temperatures ranging from 800 to 950&#xa0;°C. The XRD analysis showed that Ti<sub>3</sub>SiC<sub>2</sub> phase remains stable regardless of the sintering temperatures. The electrical properties of the resistors, including square resistance and temperature coefficient of resistance (TCR) of sintered samples, were examined. Several thick-film resistors with thickness of 13 ~ 15&#xa0;μm were prepared, showing the square resistance in the range of tens to thousands Ω/□. Due to the TEC mismatch between the film layer and the substrate, the TCR of the synthesized thick-film resistor is as low as ± 100&#xa0;ppm/°C. The refiring process increased resistance and decreased TCR of the resistive films. Aging tests at 125&#xa0;°C showed that the denser thick-film resistors formed with higher glass content had better thermal stability after 800&#xa0;h. This work demonstrates the potential of cost-effective Ti<sub>3</sub>SiC<sub>2</sub>-based pastes in producing reliable and stable TFRs for thick-film hybrid integrated circuits.</p>

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Ti3SiC2-based resistor paste for thick-film hybrid integrated circuit: the preparation and electrical properties

  • 期刊论文

  • 发表日期：

    2025年1月15日

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  • Zhigang Li,
  • Zeya Huang,
  • Renli Fu,
  • Min Yu,
  • Shibo Li,
  • Shukai Fan,
  • Guoping Bei

摘要

Thick-film resistors are one of the essential passive components in thick-film hybrid integrated circuit, often made from expensive RuO2-based paste. Herein, a resistor paste containing Ti3SiC2 cermet and CaO-B2O3-SiO2 (CBS) glass has been developed to prepare thick-film resistors. Ti3SiC2 with excellent electrical conductivity and low cost was used as the conductive phase materials. CBS glass frits were prepared as inorganic binder phase. Ti3SiC2-based resistor pastes containing different contents of the glass frit were sintered on alumina substrate at temperatures ranging from 800 to 950 °C. The XRD analysis showed that Ti3SiC2 phase remains stable regardless of the sintering temperatures. The electrical properties of the resistors, including square resistance and temperature coefficient of resistance (TCR) of sintered samples, were examined. Several thick-film resistors with thickness of 13 ~ 15 μm were prepared, showing the square resistance in the range of tens to thousands Ω/□. Due to the TEC mismatch between the film layer and the substrate, the TCR of the synthesized thick-film resistor is as low as ± 100 ppm/°C. The refiring process increased resistance and decreased TCR of the resistive films. Aging tests at 125 °C showed that the denser thick-film resistors formed with higher glass content had better thermal stability after 800 h. This work demonstrates the potential of cost-effective Ti3SiC2-based pastes in producing reliable and stable TFRs for thick-film hybrid integrated circuits.