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<p>The In-48Sn/Cu solder joints were fabricated by transient liquid phase (TLP) bonding, and the morphology and growth kinetics of the interfacial intermetallic compounds (IMC) layer were investigated. The results showed that the thin and flat interfacial IMC Cu<sub>2</sub>(In, Sn) layer extended into and spalled off in the solder center region. The grains of the interfacial IMC layer coarsened and transformed from a fine rod-like structure to a coarse hexagonal prism-like structure with prominent facets. Spalled IMC particles hinder the coarsening of the interfacial IMC grains. The growth time coefficient of the interfacial IMC layer ranges from 0.306 to 0.427, and the growth activation energy is about 59.98&#xa0;kJ/mol. The growth mechanism changes from grain boundary motion at 40–60&#xa0;°C to diffusion growth at 80–100&#xa0;°C.</p>

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Growth kinetics of interfacial intermetallic layer of In-48Sn/Cu solder joint by transient liquid phase bonding

  • 期刊论文

  • 发表日期：

    2025年1月9日

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  • Yaocheng Zhang,
  • Zheng Liu,
  • Tao Meng,
  • Kaijian Lu,
  • Li Yang

摘要

The In-48Sn/Cu solder joints were fabricated by transient liquid phase (TLP) bonding, and the morphology and growth kinetics of the interfacial intermetallic compounds (IMC) layer were investigated. The results showed that the thin and flat interfacial IMC Cu2(In, Sn) layer extended into and spalled off in the solder center region. The grains of the interfacial IMC layer coarsened and transformed from a fine rod-like structure to a coarse hexagonal prism-like structure with prominent facets. Spalled IMC particles hinder the coarsening of the interfacial IMC grains. The growth time coefficient of the interfacial IMC layer ranges from 0.306 to 0.427, and the growth activation energy is about 59.98 kJ/mol. The growth mechanism changes from grain boundary motion at 40–60 °C to diffusion growth at 80–100 °C.