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<p>In this work, the effect of solder mask leaching on the electroless Ni(P) plating process was investigated. We found that the chemical leaching promotes the density of the nucleation sites, grain boundaries, and pits forming in the nodule structure of the Ni(P) plating layer. Notably, the solder-mask leaching chemicals greatly degraded the corrosion resistance of the Ni(P) layer. The nodule boundaries of the Ni(P) layer plated with solder mask leaching in the electroless Ni(P) plating solution were corroded and widened after the corrosion test. Tafel electrochemical tests also show that the solder mask leaching chemicals reduce the corrosion potential of the Ni(P) layer. Using gas-chromatography-mass spectrometry analysis, 4-(Methylthio) benzaldehyde has been determined to be the chemical compound leaching out of the solder mask in the electroless Ni(P) plating solution. Tafel analysis shows that the corrosion potential of the Ni(P) layer was reduced by 4-(Methylthio)benzaldehyde additive in electroless Ni(P) plating solution. X-ray photoelectron spectrum analysis demonstrates that the P-content in the Ni(P) layer clearly decreases with 4-(Methylthio)benzaldehyde. Thus, we can conclude that the decrease in the corrosion resistance is caused by the P-content decrease in the Ni(P) layer due to the 4-(Methylthio)benzaldehyde additive. Open-circuit-voltage analysis indicates that 4-(Methylthio)benzaldehyde promotes the oxidation of H<sub>2</sub>PO<sub>2</sub><sup>−</sup> and the reduction of H<sub>2</sub>PO<sub>2</sub><sup>−</sup>, which therefore reduce the P-content in the Ni(P) layer. Consequently, owing to lower P-content incorporated in the Ni(P) layer, the crystallinity of the Ni(P) layer would be promoted. It has been verified by X-ray diffraction, TEM bright-field images, and selected area diffraction pattern.</p>

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Analysis of leaching chemicals from solder mask and effect on electroless Ni(P) plating

  • 期刊论文

  • 发表日期：

    2025年1月3日

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  • Zhong-Yen Yu,
  • Chen-Yu Wu,
  • Kuan-Lin Fu,
  • Jui-Sheng Chang,
  • Tzu-Hsuan Yen,
  • Chieh-Pu Tsai,
  • Ya-Hui Hsu,
  • Yun-Fong Lee,
  • Cheng-Yi Liu

摘要

In this work, the effect of solder mask leaching on the electroless Ni(P) plating process was investigated. We found that the chemical leaching promotes the density of the nucleation sites, grain boundaries, and pits forming in the nodule structure of the Ni(P) plating layer. Notably, the solder-mask leaching chemicals greatly degraded the corrosion resistance of the Ni(P) layer. The nodule boundaries of the Ni(P) layer plated with solder mask leaching in the electroless Ni(P) plating solution were corroded and widened after the corrosion test. Tafel electrochemical tests also show that the solder mask leaching chemicals reduce the corrosion potential of the Ni(P) layer. Using gas-chromatography-mass spectrometry analysis, 4-(Methylthio) benzaldehyde has been determined to be the chemical compound leaching out of the solder mask in the electroless Ni(P) plating solution. Tafel analysis shows that the corrosion potential of the Ni(P) layer was reduced by 4-(Methylthio)benzaldehyde additive in electroless Ni(P) plating solution. X-ray photoelectron spectrum analysis demonstrates that the P-content in the Ni(P) layer clearly decreases with 4-(Methylthio)benzaldehyde. Thus, we can conclude that the decrease in the corrosion resistance is caused by the P-content decrease in the Ni(P) layer due to the 4-(Methylthio)benzaldehyde additive. Open-circuit-voltage analysis indicates that 4-(Methylthio)benzaldehyde promotes the oxidation of H2PO2− and the reduction of H2PO2−, which therefore reduce the P-content in the Ni(P) layer. Consequently, owing to lower P-content incorporated in the Ni(P) layer, the crystallinity of the Ni(P) layer would be promoted. It has been verified by X-ray diffraction, TEM bright-field images, and selected area diffraction pattern.