Al/AlN-based thermal paste fillers prepared by self-propagating high-temperature synthesis (SHS)

This paper describes the synthesis of material with different aluminum and aluminum nitride concentrations through the nitriding combustion of aluminum. The effect of pre-nitrided additives on combustion rate, maximum combustion temperature, and nitrogen and oxygen content in the synthesized products is analyzed. Additionally, the phase composition and microstructure of the synthesized materials are presented. The synthesized material is used as filler for thermal paste with an organosilicon binder (polymethylsiloxane). The thermal paste with filler, produced by one-step combustion of aluminum with the highest amount of unreacted aluminum, exhibited the highest thermal conductivity coefficient. With increasing the aluminum concentration, the thermal paste maintained its dielectric properties. The thermal paste demonstrated high efficiency in dissipating heat when applied between the heatsink and the heated body. The CPU stress test confirmed its effectiveness.