Comprehensive investigation of oxidation behavior on ternary In–Zn–Sn lead-free solder electronic materials

The Oxidation behavior of ternary electronic lead-free solder In–Sn–Zn alloys are determined at 500, 600, and 700 °C by thermo gravimetric assembly system (TGA) which has been hooked up with a CAHN-1000 auto electric balance for alloys x_Zn = 0.9, x_In/x_Sn = 1/1, x_Zn = 0.9, x_In/x_Sn = ½ and x_Zn = 0.5, x_In/x_Sn = ½. The oxidation was carried out in the air for 50 min. The oxidation rate increases with temperature and decreases with time for the given alloy. The rate of oxidation also increases with the increase of zinc content in the alloy. It has also been observed that the alloy's oxidation rate decreases with the increase of In/Sn ratio, and the oxidation processes follow the parabolic rate law. The oxidation rate of alloyx_Zn = 0.9, xIn/x_Sn = ½ is higher at 700 °C as compared to the other two alloys.