<p>Ultrathin polymer coatings on silicon (Si) substrates are widely employed in microelectronic and semiconductor technologies; however, thermal dewetting severely limits their long-term reliability. Although nanoparticle additives have been extensively investigated to mitigate dewetting, the role of metal-oxide interfacial layers—and their potential synergistic interaction with nanoparticle reinforcement—remains insufficiently understood. In particular, the thickness-dependent influence of interfacial structure and crystallinity on polymer stability has not been systematically established. Here, zinc oxide (ZnO) interfacial layers with thicknesses of 5, 10, and 90&#xa0;nm were deposited on Si substrates via direct-current magnetron sputtering, followed by spin-coating of polystyrene (PS) and PS–ZnO nanocomposite films. Surface energetics were evaluated by contact angle measurements, dewetting kinetics were quantified using optical microscopy, and nanoscale morphology and adhesion were characterized by atomic force microscopy. The 5-nm ZnO interfacial layer exhibits the most effective suppression of thermal dewetting, particularly for PS–ZnO composite coatings, whereas the 10-nm layer shows markedly reduced stability despite its higher measured adhesion. The results indicate that nanoscale roughness, surface polarity distribution, and crystallographic organization collectively govern interfacial chain mobility and effective viscosity at the substrate–polymer interface. These findings establish thickness-dependent interfacial engineering as a key strategy for enhancing the thermal stability of polymer nanofilms on semiconductor substrates.</p>

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Role of ZnO interfacial layers and nanoparticles in enhancing the thermal stability of polystyrene thin films on silicon

  • Nampueng Pangpaiboon,
  • Chomsamon Chompookam,
  • Jirasaya Wongkhwanmuang,
  • Phanawan Whangdee,
  • Komsun Lapawae,
  • Kitiphat Sinthiptharakoon

摘要

Ultrathin polymer coatings on silicon (Si) substrates are widely employed in microelectronic and semiconductor technologies; however, thermal dewetting severely limits their long-term reliability. Although nanoparticle additives have been extensively investigated to mitigate dewetting, the role of metal-oxide interfacial layers—and their potential synergistic interaction with nanoparticle reinforcement—remains insufficiently understood. In particular, the thickness-dependent influence of interfacial structure and crystallinity on polymer stability has not been systematically established. Here, zinc oxide (ZnO) interfacial layers with thicknesses of 5, 10, and 90 nm were deposited on Si substrates via direct-current magnetron sputtering, followed by spin-coating of polystyrene (PS) and PS–ZnO nanocomposite films. Surface energetics were evaluated by contact angle measurements, dewetting kinetics were quantified using optical microscopy, and nanoscale morphology and adhesion were characterized by atomic force microscopy. The 5-nm ZnO interfacial layer exhibits the most effective suppression of thermal dewetting, particularly for PS–ZnO composite coatings, whereas the 10-nm layer shows markedly reduced stability despite its higher measured adhesion. The results indicate that nanoscale roughness, surface polarity distribution, and crystallographic organization collectively govern interfacial chain mobility and effective viscosity at the substrate–polymer interface. These findings establish thickness-dependent interfacial engineering as a key strategy for enhancing the thermal stability of polymer nanofilms on semiconductor substrates.