Scholarlink

<p>Tin whiskers are generally defined as spontaneous metallic protrusions (primarily <i>β</i>-Sn) that erupt from the surface of tin-based finishes. Their growth is notoriously difficult to predict and poses significant threats to the reliability of electronic systems, often leading to unforeseen consequences. With the rapid advancement of electronic device miniaturization and high-density packaging, the decreasing pitch between component leads, coupled with the widespread adoption of lead-free tin alloys, has further exacerbated the severity of the whisker issue. At present, multiple evaluation standards for tin whisker growth propensity have been established by international organizations such as JEDEC, IPC, and IEC, as well as by several companies, aiming to standardize the testing, assessment, and mitigation measures for tin whisker growth. The factors addressed in these standards primarily include environmental variables such as temperature and humidity. However, notable issues remain, including insufficient data collection on whisker growth, unclear equivalence between accelerated whisker tests and actual service conditions, and disagreements regarding the acceptance of different standards. This work provides an overview of the tin whisker phenomenon and its associated risks, reviews the existing evaluation standards, discusses their limitations, and finally proposes recommendations to facilitate the development of reliable assessment and mitigation strategies, thereby supporting both the reliability of electronic systems and the sustainable development of the electronics industry.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Review: tin whisker growth—associated risks, and propensity assessment standards

  • 期刊论文

  • 发表日期：

    2026年7月20日

查看全文
  • Peigen Zhang,
  • Haoze Song,
  • Xinxin Xia,
  • Jinshuai Xie,
  • Fugang Nie,
  • Jian Liang,
  • Bo Li,
  • Jianxiang Ding,
  • Wei Zheng,
  • ZhengMing Sun

摘要

Tin whiskers are generally defined as spontaneous metallic protrusions (primarily β-Sn) that erupt from the surface of tin-based finishes. Their growth is notoriously difficult to predict and poses significant threats to the reliability of electronic systems, often leading to unforeseen consequences. With the rapid advancement of electronic device miniaturization and high-density packaging, the decreasing pitch between component leads, coupled with the widespread adoption of lead-free tin alloys, has further exacerbated the severity of the whisker issue. At present, multiple evaluation standards for tin whisker growth propensity have been established by international organizations such as JEDEC, IPC, and IEC, as well as by several companies, aiming to standardize the testing, assessment, and mitigation measures for tin whisker growth. The factors addressed in these standards primarily include environmental variables such as temperature and humidity. However, notable issues remain, including insufficient data collection on whisker growth, unclear equivalence between accelerated whisker tests and actual service conditions, and disagreements regarding the acceptance of different standards. This work provides an overview of the tin whisker phenomenon and its associated risks, reviews the existing evaluation standards, discusses their limitations, and finally proposes recommendations to facilitate the development of reliable assessment and mitigation strategies, thereby supporting both the reliability of electronic systems and the sustainable development of the electronics industry.