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<p>The mechanical reliability of solder joints under ultra-low temperatures is of critical importance for electronic devices operating in cryogenic deep-space environments. In this work, the tensile behaviors of Sn-0.3Ag-0.7Cu (SAC0307)/Cu solder joints with two thicknesses were systematically investigated across a temperature range from − 190 °C to room temperature. Planar fracture surface analysis was conducted to determine the failure locations and elucidate the underlying fracture mechanisms at different temperatures. The results reveal a non-monotonic temperature dependence of tensile strength, which initially increases and subsequently decreases with decreasing temperature, while increasing solder joint thickness leads to a noticeable reduction in strength. Microstructural observations indicate the formation of subgrains and deformation twins during tensile deformation, suggesting that plastic deformation is governed by the concurrent activation of dislocation slip and deformation twinning at cryogenic temperatures. Furthermore, as the temperature decreases, the dominant fracture location shifts from the solder matrix to the solder/intermetallic compound (IMC) interface or the interfacial IMC layer, resulting in a transition of fracture mode from ductile to brittle behavior. These findings provide valuable insights into the thickness-dependent mechanical reliability and failure mechanisms of SAC0307/Cu solder joints for cryogenic electronic applications.</p>

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Mechanical response and ductile-to-brittle fracture transition of Sn-0.3Ag-0.7Cu/Cu solder joints at cryogenic temperatures

  • 期刊论文

  • 发表日期：

    2026年5月19日

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  • Wen Jiang,
  • Wenwang Wu,
  • Yaxin Zhu,
  • Changwei Wang

摘要

The mechanical reliability of solder joints under ultra-low temperatures is of critical importance for electronic devices operating in cryogenic deep-space environments. In this work, the tensile behaviors of Sn-0.3Ag-0.7Cu (SAC0307)/Cu solder joints with two thicknesses were systematically investigated across a temperature range from − 190 °C to room temperature. Planar fracture surface analysis was conducted to determine the failure locations and elucidate the underlying fracture mechanisms at different temperatures. The results reveal a non-monotonic temperature dependence of tensile strength, which initially increases and subsequently decreases with decreasing temperature, while increasing solder joint thickness leads to a noticeable reduction in strength. Microstructural observations indicate the formation of subgrains and deformation twins during tensile deformation, suggesting that plastic deformation is governed by the concurrent activation of dislocation slip and deformation twinning at cryogenic temperatures. Furthermore, as the temperature decreases, the dominant fracture location shifts from the solder matrix to the solder/intermetallic compound (IMC) interface or the interfacial IMC layer, resulting in a transition of fracture mode from ductile to brittle behavior. These findings provide valuable insights into the thickness-dependent mechanical reliability and failure mechanisms of SAC0307/Cu solder joints for cryogenic electronic applications.