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<p>With the rapid development of the electronics and information industry, nickel-vanadium alloy sputtering targets are increasingly replacing conventional pure Ni targets and have become an important material choice. In this study, the sputtering behaviors of hot-rolled and cold-rolled NiV (7&#xa0;wt.%) targets and their corresponding annealed states were compared under identical deposition conditions. The results show that, as sputtering time increases, film grains gradually coarsen and columnar-island features develop and grow on the surface, leading to a continuous increase in surface roughness. Meanwhile, the number of columnar islands increases and larger islands form; partial coalescence of these islands produces a denser and relatively flatter film surface. Confocal profilometry of the target racetracks indicates that, under the same sputtering time, the target in the hot-rolled and annealed state exhibits the smallest erosion depth, suggesting a longer service life and higher material use efficiency under identical sputtering conditions. For all target states, the film resistivity decreases with increasing sputtering time and converges to a similar level at 30&#xa0;min. Because the annealed NiV (7&#xa0;wt.%) targets exhibit superior physical performance, the target in the hot-rolled and annealed state was further examined to clarify its microstructural characteristics. The results reveal fine, uniformly distributed grains and a more concentrated crystallographic orientation, which are beneficial for improving sputtering stability. Annealing after hot rolling is an effective approach to obtain an optimized target microstructure. These findings provide useful guidance for the fabrication and microstructural optimization of metallic sputtering targets.</p>

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Correlation between microstructural features and sputtering properties of NiV (7 wt.%) targets

  • 期刊论文

  • 发表日期：

    2026年5月17日

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  • Jiangchao Xue,
  • Xiaoyi Pu,
  • Hongyan Wang,
  • Linqing Yang,
  • Han Xiao,
  • Ming Wen

摘要

With the rapid development of the electronics and information industry, nickel-vanadium alloy sputtering targets are increasingly replacing conventional pure Ni targets and have become an important material choice. In this study, the sputtering behaviors of hot-rolled and cold-rolled NiV (7 wt.%) targets and their corresponding annealed states were compared under identical deposition conditions. The results show that, as sputtering time increases, film grains gradually coarsen and columnar-island features develop and grow on the surface, leading to a continuous increase in surface roughness. Meanwhile, the number of columnar islands increases and larger islands form; partial coalescence of these islands produces a denser and relatively flatter film surface. Confocal profilometry of the target racetracks indicates that, under the same sputtering time, the target in the hot-rolled and annealed state exhibits the smallest erosion depth, suggesting a longer service life and higher material use efficiency under identical sputtering conditions. For all target states, the film resistivity decreases with increasing sputtering time and converges to a similar level at 30 min. Because the annealed NiV (7 wt.%) targets exhibit superior physical performance, the target in the hot-rolled and annealed state was further examined to clarify its microstructural characteristics. The results reveal fine, uniformly distributed grains and a more concentrated crystallographic orientation, which are beneficial for improving sputtering stability. Annealing after hot rolling is an effective approach to obtain an optimized target microstructure. These findings provide useful guidance for the fabrication and microstructural optimization of metallic sputtering targets.