<p>Controlling the solidification behavior and microstructural evolution of Sn–Ag–Cu (SAC) alloys is critical for electronic joint reliability. This work investigates the microstructural modification and mechanical enhancement of SAC305 solder doped with cellulose nanofibers (CNFs). Through transmission electron microscopy (TEM), electron probe microanalysis (EPMA) and thermogravimetric analysis (TGA), we identified that CNFs undergo partial pyrolysis to form carbonaceous particles upon reflow. These particles serve as heterogeneous nucleation sites for Ag<sub>3</sub>Sn, reducing the undercooling required for solidification, effectively refining Ag<sub>3</sub>Sn particles and promoting a transition to a refined equiaxed grain structure. Statistical analysis via electron backscatter diffraction (EBSD) showed that 0.05&#xa0;wt% CNF addition reduced the grain size from 28.04 to 14.89&#xa0;µm. Mechanically, this refinement translated to a 60% increase in shear strength and significant hardness enhancement. Crucially, the doped solder maintained superior mechanical properties and finer grain sizes even after aging at 180&#xa0;°C for 30&#xa0;days, attributed to the Zener pinning pressure exerted by the uniformly distributed precipitates. This study demonstrates that CNFs offer a scalable, dispersion-friendly alternative to traditional carbon allotropes for regulating grain growth kinetics and enhancing solder joint reliability. </p> Graphical abstract <p></p>

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In-situ pyrolysis of cellulose nanofibers for grain refinement and mechanical reinforcement of solder alloy

  • Chia-Jung Hsu,
  • Chun-Yung Huang,
  • Wei-Ting Lin,
  • Chang-Meng Wang,
  • Yu-Cheng Chen,
  • Tsao-Cheng Huang,
  • Chao-Chin Chang,
  • Hiroshi Nishikawa,
  • Albert T. Wu

摘要

Controlling the solidification behavior and microstructural evolution of Sn–Ag–Cu (SAC) alloys is critical for electronic joint reliability. This work investigates the microstructural modification and mechanical enhancement of SAC305 solder doped with cellulose nanofibers (CNFs). Through transmission electron microscopy (TEM), electron probe microanalysis (EPMA) and thermogravimetric analysis (TGA), we identified that CNFs undergo partial pyrolysis to form carbonaceous particles upon reflow. These particles serve as heterogeneous nucleation sites for Ag3Sn, reducing the undercooling required for solidification, effectively refining Ag3Sn particles and promoting a transition to a refined equiaxed grain structure. Statistical analysis via electron backscatter diffraction (EBSD) showed that 0.05 wt% CNF addition reduced the grain size from 28.04 to 14.89 µm. Mechanically, this refinement translated to a 60% increase in shear strength and significant hardness enhancement. Crucially, the doped solder maintained superior mechanical properties and finer grain sizes even after aging at 180 °C for 30 days, attributed to the Zener pinning pressure exerted by the uniformly distributed precipitates. This study demonstrates that CNFs offer a scalable, dispersion-friendly alternative to traditional carbon allotropes for regulating grain growth kinetics and enhancing solder joint reliability.

Graphical abstract