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<p>Cu-based eutectic high-entropy alloy coatings (CuECs) were fabricated using a novel reverse thermal infiltration coating process. The tribological behaviors and wear mechanisms of the CuEC were investigated in the broad temperature range 25–750&#xa0;°C. The wear resistance of CuEC was significantly improved compared to Cu at various temperatures, attributed to the smaller grain size and higher dislocation density provided by an EHEA coating. Compared to pure Cu, the cross-sectional areas of wear scars on CuEC specimens decreased by 93.8%, 93.1%, 84.6%, and 78.2% at 25&#xa0;°C, 250&#xa0;°C, 500&#xa0;°C, and 750&#xa0;°C, respectively. Furthermore, the plastic pileup area in the cross section of CuEC was reduced by more than 86.5% compared to that of pure copper across all tested temperatures, indicating a significantly enhanced resistance to deformation. The primary wear mechanism for Cu was adhesive wear, while it was abrasive wear for CuEC. At high temperatures, oxidative wear was superimposed on both materials, accompanied by localized fatigue wear. Additionally, the wear mechanism of CuEC transitioned to adhesive wear at 750&#xa0;°C. This work provides insights into developing new wear-resistant coatings on the surface of copper-based materials that are applicable in a broad temperature range, and presents a low-cost and easy-to-operate idea for coating processing.</p>

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Enhancing the high-temperature wear resistance of copper via EHEA coatings prepared by reverse thermal infiltration

  • 期刊论文

  • 发表日期：

    2026年7月29日

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  • Yuqi Sun,
  • Tianye Yang,
  • Shunbo Wang,
  • Gaojie Xuan,
  • Meiting He,
  • Ruitao Ma,
  • Yubin Lan,
  • Hang Zhu

摘要

Cu-based eutectic high-entropy alloy coatings (CuECs) were fabricated using a novel reverse thermal infiltration coating process. The tribological behaviors and wear mechanisms of the CuEC were investigated in the broad temperature range 25–750 °C. The wear resistance of CuEC was significantly improved compared to Cu at various temperatures, attributed to the smaller grain size and higher dislocation density provided by an EHEA coating. Compared to pure Cu, the cross-sectional areas of wear scars on CuEC specimens decreased by 93.8%, 93.1%, 84.6%, and 78.2% at 25 °C, 250 °C, 500 °C, and 750 °C, respectively. Furthermore, the plastic pileup area in the cross section of CuEC was reduced by more than 86.5% compared to that of pure copper across all tested temperatures, indicating a significantly enhanced resistance to deformation. The primary wear mechanism for Cu was adhesive wear, while it was abrasive wear for CuEC. At high temperatures, oxidative wear was superimposed on both materials, accompanied by localized fatigue wear. Additionally, the wear mechanism of CuEC transitioned to adhesive wear at 750 °C. This work provides insights into developing new wear-resistant coatings on the surface of copper-based materials that are applicable in a broad temperature range, and presents a low-cost and easy-to-operate idea for coating processing.