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<p>This study elucidates the strain rate-dependent mechanisms of void nucleation and growth in single-crystal copper subjected to shock and quasi-isentropic loading, using integrated molecular dynamics simulations and SEM characterization. Cross sectional analyses reveal that shock loading produces irregular voids confined to narrow damage bands (~ 100&#xa0;μm) via explosive dislocation avalanches, whereas quasi-isentropic loading activates limited slip systems, promoting crystallographically faceted rhombohedral voids within expanded damage zones (~ 320&#xa0;μm). A transition from dislocation-mediated plasticity to diffusion-assisted growth is identified, with quasi-isentropic loading yielding ~ 40% larger voids due to the prolonged tensile duration.</p>

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Void formation mechanisms in the spallation process of copper under different dynamic loading conditions

  • 期刊论文

  • 发表日期：

    2026年4月29日

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  • Jianian Hu,
  • Shi Fang,
  • Haotian Zhang,
  • Jiajin Li

摘要

This study elucidates the strain rate-dependent mechanisms of void nucleation and growth in single-crystal copper subjected to shock and quasi-isentropic loading, using integrated molecular dynamics simulations and SEM characterization. Cross sectional analyses reveal that shock loading produces irregular voids confined to narrow damage bands (~ 100 μm) via explosive dislocation avalanches, whereas quasi-isentropic loading activates limited slip systems, promoting crystallographically faceted rhombohedral voids within expanded damage zones (~ 320 μm). A transition from dislocation-mediated plasticity to diffusion-assisted growth is identified, with quasi-isentropic loading yielding ~ 40% larger voids due to the prolonged tensile duration.