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<p>Heterojunction solar cells (HJT) and perovskite solar cells (PSC) present high efficiency advantages in combining as tandem cells, whereas the high cost of silver-based electrode materials severely restricts the application of HJT cells. Copper-based materials, with their high conductivity and low cost, exhibit significant potential as replacements for silver-based electrode materials, thus emerging as important candidate high-performance electrode materials. In this work, we propose a morphology reconstruction strategy by blending flake copper powder (providing ‘surface’ connections) with spherical copper powder (providing ‘point’ connections) to form a three-dimensional interconnected conductive network, thereby enhancing the electrical properties of the copper paste. Furthermore, we employ formate ions and oleic amine to passivate the blended copper powder, improving the antioxidant properties of the paste. By optimizing the resin content, resin-to-curing agent ratio, and curing temperature, a high-performance copper paste was successfully developed. The resulting paste achieved a resistivity of 23.43&#xa0;µΩ·cm and an adhesion rating of 5B with 6 wt% resin and a 1:1 resin-to-curing agent ratio, after curing at 240&#xa0;°C for 40&#xa0;min. This work provides a novel paradigm for the preparation of anti-oxidation conductive copper paste, demonstrating the significant potential of copper paste as a replacement for silver-based paste in HJT cell metallization.</p> Graphical abstract <p></p>

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Low-temperature sinterable copper paste with a flake-spherical hybrid network and enhanced anti-oxidation properties

  • 期刊论文

  • 发表日期：

    2026年4月10日

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  • Gaoyuan Chen,
  • Siwen Yu,
  • Lei Duan,
  • Yiping Tang,
  • Yuchuan Cheng,
  • Jianjun Guo,
  • Aihua Sun

摘要

Heterojunction solar cells (HJT) and perovskite solar cells (PSC) present high efficiency advantages in combining as tandem cells, whereas the high cost of silver-based electrode materials severely restricts the application of HJT cells. Copper-based materials, with their high conductivity and low cost, exhibit significant potential as replacements for silver-based electrode materials, thus emerging as important candidate high-performance electrode materials. In this work, we propose a morphology reconstruction strategy by blending flake copper powder (providing ‘surface’ connections) with spherical copper powder (providing ‘point’ connections) to form a three-dimensional interconnected conductive network, thereby enhancing the electrical properties of the copper paste. Furthermore, we employ formate ions and oleic amine to passivate the blended copper powder, improving the antioxidant properties of the paste. By optimizing the resin content, resin-to-curing agent ratio, and curing temperature, a high-performance copper paste was successfully developed. The resulting paste achieved a resistivity of 23.43 µΩ·cm and an adhesion rating of 5B with 6 wt% resin and a 1:1 resin-to-curing agent ratio, after curing at 240 °C for 40 min. This work provides a novel paradigm for the preparation of anti-oxidation conductive copper paste, demonstrating the significant potential of copper paste as a replacement for silver-based paste in HJT cell metallization.

Graphical abstract