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<p>This study investigates the mechanical properties, biocompatibility, and cytotoxicity of additively manufactured <i>β</i>-TCP bone scaffolds with triply periodic minimal surface (TPMS) based designs. Compression strength testing revealed that the diamond TPMS structure exhibited superior mechanical stability compared to other geometries, despite minor variability. Pore formers introduced controlled porosity, resulting in uniform spherical pores without compromising structural integrity. Biocompatibility assessments demonstrated robust cell proliferation across all scaffolds, comparable to 2D controls, with minimal cytotoxic effects observed over the testing period. The manufacturing process had no adverse impact on scaffold performance, reinforcing the potential of high-resolution diamond TPMS-based <i>β</i>-TCP scaffolds for bone tissue engineering applications.</p>

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Optimizing β-TCP bone scaffolds: the influence of additive manufacturing, TPMS structures, and pore formers

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2026年3月6日

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  • Wadih Yared,
  • Tobias Nies,
  • Julian Hoffmann,
  • Anna Baghnavi,
  • Antonia Klumpp,
  • Michael Seidenstuecker,
  • Frank Kern,
  • Wolfgang Rheinheimer

摘要

This study investigates the mechanical properties, biocompatibility, and cytotoxicity of additively manufactured β-TCP bone scaffolds with triply periodic minimal surface (TPMS) based designs. Compression strength testing revealed that the diamond TPMS structure exhibited superior mechanical stability compared to other geometries, despite minor variability. Pore formers introduced controlled porosity, resulting in uniform spherical pores without compromising structural integrity. Biocompatibility assessments demonstrated robust cell proliferation across all scaffolds, comparable to 2D controls, with minimal cytotoxic effects observed over the testing period. The manufacturing process had no adverse impact on scaffold performance, reinforcing the potential of high-resolution diamond TPMS-based β-TCP scaffolds for bone tissue engineering applications.