Novel test method to measure time-cure superposition shift factors of filled-thermoset under isocure testing conditions
摘要
Despite the solid theoretical foundation of time-cure superposition, the time-cure superposition (TCS) shift factors reported in the literature do not support the theory very well. The discrepancy stems from the non-isocure test conditions used in the tests. This study proposes a novel method to eliminate the inherent problems of existing techniques to measure the TCS shift factors, i.e., to measure them under isocure test conditions. The proposed method optimizes a test procedure while offering sufficient relaxation but producing no or negligible additional curing during testing. Optimization requires a complete understanding of curing behavior not only in the chemically-controlled domain but also in the diffusion-controlled domain. The method is implemented for an epoxy-based molding compound. Portions of the storage master curves are obtained at four partially-cured states