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<p>As conductive fillers, the uniformity and compactness of composite metal powders are crucial for preparing high-performance conductive pastes. In this study, a self-circulating electroplating method was proposed, which could efficiently deposit Sn plating on the seed of Cu micro-flakes to prepare composite metal powders. The effects of total electroplating time, single electroplating time, loading mass of Cu seeds on the cathode support, and the bath temperature on Sn plating layer have been systematically investigated and optimized. And the influence mechanisms of electroplating parameters on coating coverage, compactness, and uniformity of Sn plating layer were proposed. The Sn-coated Cu micro-flakes with compact plating layer of 142.9&#xa0;nm thickness were obtained with the total electroplating time of 60&#xa0;min, the single electroplating time of 3&#xa0;min, and the loading mass of Cu seeds of 18&#xa0;mg/cm<sup>2</sup> at the bath temperature of 15&#xa0;°C. Finally, the as-prepared Sn-coated Cu micro-flakes were used as fillers to prepare conductive pastes, which exhibited good antioxidation performance at 85℃ and 85%R.H.</p> Graphical abstract <p></p>

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Controllable fabrication of Sn-coated Cu micro-flakes via self-circulating electroplating

  • 期刊论文

  • 发表日期：

    2025年12月22日

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  • Hengyu Zhao,
  • Baoyu Wang,
  • Shiqing Yang,
  • Huamiao Zhu,
  • Zihao Zhang,
  • Wenyao Li,
  • Xiangmin Yang,
  • Bin Fang,
  • Ying Liang,
  • Zhen Zhang

摘要

As conductive fillers, the uniformity and compactness of composite metal powders are crucial for preparing high-performance conductive pastes. In this study, a self-circulating electroplating method was proposed, which could efficiently deposit Sn plating on the seed of Cu micro-flakes to prepare composite metal powders. The effects of total electroplating time, single electroplating time, loading mass of Cu seeds on the cathode support, and the bath temperature on Sn plating layer have been systematically investigated and optimized. And the influence mechanisms of electroplating parameters on coating coverage, compactness, and uniformity of Sn plating layer were proposed. The Sn-coated Cu micro-flakes with compact plating layer of 142.9 nm thickness were obtained with the total electroplating time of 60 min, the single electroplating time of 3 min, and the loading mass of Cu seeds of 18 mg/cm2 at the bath temperature of 15 °C. Finally, the as-prepared Sn-coated Cu micro-flakes were used as fillers to prepare conductive pastes, which exhibited good antioxidation performance at 85℃ and 85%R.H.

Graphical abstract