Mechanical, dielectric, thermal evolution, and aging mechanism of liquid crystal polymer films for 5G communication applications under humidity and heat conditions
摘要
Liquid crystal polymer (LCP) has emerged as promising solution for 5G communication applications owing to its exceptional properties and suitability for high-frequency applications. To ensure sustained reliability in the face of harsh operating conditions, extensive research on aging mechanisms and strategies to mitigate aging-induced quality challenges associated with LCP materials is essential. In this context, LCP films were successfully synthesized through a standard blow-molding technique, followed by a comprehensive study of their aging behavior and mechanisms under humidity and heat conditions. The results of the study indicated that the LCP film maintained a high level of resistance to humid-heat conditions at specific temperature (85 °C) and humidity levels (85% RH). Specifically, only the dissipation factor (Df) values exhibited a slight increase with prolonged aging duration, while other properties such as tensile property, thermal behavior, color change, and water absorption remained unchanged. Specific fluorescence recognition revealed the possible aging mechanism owing to its high sensitivity. At the early aging stage, a small level of hydrothermal degradation occurred. As aging advances, the LCP polymer chains exhibited increased orderliness and compactness, resulting in a significant reduction in the hydrolysis rate. These findings provide valuable insights for guiding the long-term utilization of LCP films under humidity and heat conditions.
Graphical abstractA kind of 5G communication used liquid crystal polymer and comprehensively investigated its aging behavior, mechanism, and service lifetime under long-term humidity and heat Conditions.