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<p>Isothermal compression tests are used to investigate the thermomechanical behavior of Cu-9Ni-6Sn(-0.1Mn) alloy at temperatures ranging from 650 to 800&#xa0;°C and strain rates between 0.01 and 10&#xa0;s<sup>−1</sup>. The study systematically examines the hot deformation behavior and microstructural evolution of Cu-9Ni-6Sn(-0.1Mn) alloys. Constitutive equations are established, revealing that the activation energy (<i>Q</i>) is assessed to be 354.21&#xa0;kJ·mol<sup>−1</sup> for Mn-containing variant, compared to 376.07&#xa0;kJ·mol<sup>−1</sup> for the base alloy, indicating that Mn addition reduces the activation energy. The addition of Mn improves the forging properties of the Cu-9Ni-6Sn alloy by influencing its dynamic recrystallization (DRX) behavior. The dominant DRX mechanisms in the Cu-9Ni-6Sn alloy are identified as continuous dynamic recrystallization (CDRX) and discontinuous dynamic recrystallization (DDRX). The addition of Mn refined the homogenized grains by over 70%, increasing grain boundary bulging nucleation sites and facilitating DDRX. At temperatures ≥ 700&#xa0;°C, the 0.1Mn alloy exhibits an increased tendency for CDRX due to misorientation angle accumulation in initial coarse grains. Mn promotes both DDRX and CDRX, resulting in a higher DRX fraction compared to the Mn-free alloy. These findings provide a theoretical foundation for optimizing hot-working processes in Cu-9Ni-6Sn alloy systems.</p>

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Mechanism of dynamic recrystallization in Cu-9Ni-6Sn alloy during hot deformation promoted by Mn: a dynamic thermal simulation study

  • 期刊论文

  • 发表日期：

    2025年11月6日

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  • Fei Zhou,
  • Yanjun Zhou,
  • Jiang Feng,
  • Longlong Lu,
  • Ran Yang,
  • Shaodan Yang,
  • Jibao Li,
  • Jidong Chen,
  • Kexing Song

摘要

Isothermal compression tests are used to investigate the thermomechanical behavior of Cu-9Ni-6Sn(-0.1Mn) alloy at temperatures ranging from 650 to 800 °C and strain rates between 0.01 and 10 s−1. The study systematically examines the hot deformation behavior and microstructural evolution of Cu-9Ni-6Sn(-0.1Mn) alloys. Constitutive equations are established, revealing that the activation energy (Q) is assessed to be 354.21 kJ·mol−1 for Mn-containing variant, compared to 376.07 kJ·mol−1 for the base alloy, indicating that Mn addition reduces the activation energy. The addition of Mn improves the forging properties of the Cu-9Ni-6Sn alloy by influencing its dynamic recrystallization (DRX) behavior. The dominant DRX mechanisms in the Cu-9Ni-6Sn alloy are identified as continuous dynamic recrystallization (CDRX) and discontinuous dynamic recrystallization (DDRX). The addition of Mn refined the homogenized grains by over 70%, increasing grain boundary bulging nucleation sites and facilitating DDRX. At temperatures ≥ 700 °C, the 0.1Mn alloy exhibits an increased tendency for CDRX due to misorientation angle accumulation in initial coarse grains. Mn promotes both DDRX and CDRX, resulting in a higher DRX fraction compared to the Mn-free alloy. These findings provide a theoretical foundation for optimizing hot-working processes in Cu-9Ni-6Sn alloy systems.