<p>Thermal interface materials are one of the important ways to solve the heat dissipation of electronic devices. However, the retention of high thermal conductivity in dusty and humid environments remains a significant challenge. In this study, we design a fluorine-modified double-nanostructured GO (named F-GO@SiO₂) coating that shows excellent self-cleaning, anti-fog, electrical insulation, and thermal conduction. This guarantees that the FR-4 epoxy fiber board coated with F-GO@SiO₂ can maintain durable high thermal conduction up to ~ 0.74 W‧m⁻¹‧K⁻¹ after 5 cycles of the fouling test. In contrast, they severely decline to ~ 0.15 and ~ 0.14 W‧m⁻¹‧K⁻¹ when coated pure GO and fluorine-modified nanoflake-like GO (F-GO). Moreover, the thermally conductive coefficient of the F-GO@SiO₂ coating on copper pipe can also maintain up to ~ 277.3 W‧m⁻²‧K⁻¹ under a 50% humidity environment after 60&#xa0;min, that is much higher than ~ 193.8 W‧m⁻²‧K⁻¹ of the pure GO or F-GO coating. This work provides a novel strategy for designing superhydrophobic thermal interface materials capable of durable heat dissipation.</p>