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<p>This study investigates the impact of Cu additions (0.15–0.4&#xa0;wt.%) on the hot deformation behavior of an Al–Mg–Si conductor alloy with a focus on how process parameters influence electrical conductivity and mechanical properties. Hot compression tests were performed at 450&#xa0;°C and 550&#xa0;°C using strain rates ranging from 0.1 to 10 s<sup>−1</sup> to achieve this objective. The results show that at 450&#xa0;°C, adding ≤ 0.3&#xa0;wt.% Cu slightly raised flow stress (up to 8.2%), while 0.4&#xa0;wt.% Cu caused a significant increase (15–25.2%). At 550&#xa0;°C, Cu’s effect markedly decreased (&lt; 3.5%), especially at lower strain rates. Moreover, activation energy rose from 143.9 to 173.3 kJ/mol with 0.15–0.4&#xa0;wt.% Cu, showing increased deformation resistance. Cu retarded the dynamic recovery and decreased the subgrain size and mean misorientation angle of the grain boundaries. Overall, alloys deformed at 450&#xa0;°C showed 8–20% lower hardness but higher electrical 1.0–2.5%IACS than those deformed at 550&#xa0;°C after both 8-h and 24-h aging, though the difference narrowed at 24 h. This behavior is attributed to coarse <i>β</i>-Mg<sub>2</sub>Si precipitates at 450&#xa0;°C, enhancing conductivity but reducing hardness. Extending aging from 8 to 24 h slightly increased conductivity (1–2.7% IACS) with minimal hardness drop (&lt; 4 HV). The findings indicate that the 0.3% Cu alloy offered the best balance—achieving up to 75 HV (20–30% higher than base alloy), slight change in deformation resistance, and maintaining 52.4–54.1%IACS conductivity within conductor standards.</p>

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Effect of hot deformation parameters on the performance and thermomechanical behavior of Cu-modified Al–Mg–Si conductor alloys

  • 期刊论文

  • 发表日期：

    2025年10月6日

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  • Behrouz Abnar,
  • Siamak Nikzad Khangholi,
  • Paul Rometsch,
  • Mousa Javidani

摘要

This study investigates the impact of Cu additions (0.15–0.4 wt.%) on the hot deformation behavior of an Al–Mg–Si conductor alloy with a focus on how process parameters influence electrical conductivity and mechanical properties. Hot compression tests were performed at 450 °C and 550 °C using strain rates ranging from 0.1 to 10 s−1 to achieve this objective. The results show that at 450 °C, adding ≤ 0.3 wt.% Cu slightly raised flow stress (up to 8.2%), while 0.4 wt.% Cu caused a significant increase (15–25.2%). At 550 °C, Cu’s effect markedly decreased (< 3.5%), especially at lower strain rates. Moreover, activation energy rose from 143.9 to 173.3 kJ/mol with 0.15–0.4 wt.% Cu, showing increased deformation resistance. Cu retarded the dynamic recovery and decreased the subgrain size and mean misorientation angle of the grain boundaries. Overall, alloys deformed at 450 °C showed 8–20% lower hardness but higher electrical 1.0–2.5%IACS than those deformed at 550 °C after both 8-h and 24-h aging, though the difference narrowed at 24 h. This behavior is attributed to coarse β-Mg2Si precipitates at 450 °C, enhancing conductivity but reducing hardness. Extending aging from 8 to 24 h slightly increased conductivity (1–2.7% IACS) with minimal hardness drop (< 4 HV). The findings indicate that the 0.3% Cu alloy offered the best balance—achieving up to 75 HV (20–30% higher than base alloy), slight change in deformation resistance, and maintaining 52.4–54.1%IACS conductivity within conductor standards.