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<p>This article investigated in detail the effect of P content on the microstructure and properties of Cu–Ni–Fe–P alloys. Through systematic alloy design, the alloys with P contents ranging from 0.13 to 0.22&#xa0;wt% were prepared. The results revealed that P element promoted the formation of fine precipitation phases (Ni, Fe)<sub>2</sub>P and refined the grain size. As the P content increased, the tensile strength and hardness first increased and then decreased, while the electrical conductivity gradually decreased. When the P content was 0.16&#xa0;wt%, the comprehensive performance was optimal. The conductivity and tensile strength of Cu–0.3Ni–0.3Fe–0.16P alloy were 62.3%IACS and 645 MPa, respectively, through cold rolling 90% reduction (90%CR) + aging (AG 450&#xa0;°C × 4&#xa0;h) + 60%CR. Compared to Cu–0.3Ni–0.3Fe–0.19P alloy, the tensile strength and conductivity increased by 62 MPa and 5.9%IACS, respectively. When the P content was 0.16&#xa0;wt%, there was a significant increase in deformation strengthening and second phase strengthening. The softening of Cu–Ni–Fe–P alloys were closely related to the recrystallization and coarsening precipitation. This study provided a theoretical basis for the rational design of Cu–Ni–Fe–P alloys with controllable microstructure and properties, suitable for lead frames and microelectronic applications.</p>

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Regulation of microstructure and properties of Cu–Ni–Fe–P alloys by the P content

  • 期刊论文

  • 发表日期：

    2025年8月2日

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  • Jianguo Cui,
  • Rui Zhou,
  • Wendi Yang,
  • Weilin Gao,
  • Jilin He

摘要

This article investigated in detail the effect of P content on the microstructure and properties of Cu–Ni–Fe–P alloys. Through systematic alloy design, the alloys with P contents ranging from 0.13 to 0.22 wt% were prepared. The results revealed that P element promoted the formation of fine precipitation phases (Ni, Fe)2P and refined the grain size. As the P content increased, the tensile strength and hardness first increased and then decreased, while the electrical conductivity gradually decreased. When the P content was 0.16 wt%, the comprehensive performance was optimal. The conductivity and tensile strength of Cu–0.3Ni–0.3Fe–0.16P alloy were 62.3%IACS and 645 MPa, respectively, through cold rolling 90% reduction (90%CR) + aging (AG 450 °C × 4 h) + 60%CR. Compared to Cu–0.3Ni–0.3Fe–0.19P alloy, the tensile strength and conductivity increased by 62 MPa and 5.9%IACS, respectively. When the P content was 0.16 wt%, there was a significant increase in deformation strengthening and second phase strengthening. The softening of Cu–Ni–Fe–P alloys were closely related to the recrystallization and coarsening precipitation. This study provided a theoretical basis for the rational design of Cu–Ni–Fe–P alloys with controllable microstructure and properties, suitable for lead frames and microelectronic applications.