<p>Glass and copper structures are used in sensor fabrication and MEMS packaging; however, there are few studies at this stage to achieve reliable connections by soldering process, because of the poor wettability between glass and solder. In this study, K9 glass and copper were bonded together by electric field-assisted soldering using Zn-10Al-12Sn solder, the wettability between glass and solder was improved, and a reliable connection was achieved with a flat and defect-free interface. The effects of bonding voltage and temperature on the interfacial microstructure and tensile strength were studied, and the mechanism of bonding formation was explored. The findings demonstrate that the typical interface structure of the K9 glass/copper joint can be described as glass/β-Sn/CuZn + CuAl/Cu₅Zn₈/copper; the thickness of the intermetallic compound and the width of the depletion layer in the interfacial structure all varied as a result of changes in bonding parameters (temperature, voltage, and bonding time). The formation of a Na⁺ depletion layer and the diffusion of Al³⁺ and Sn²⁺ into the glass are thought to be the causes of the bonding process. The bonding parameters have a significant impact on then tensile strength. The maximum tensile strength of the joints is 11.26&#xa0;MPa, which was obtained under anodic bonding process at 420&#xa0;°C and 1400&#xa0;V for 10&#xa0;min.</p>