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<p>Due to the severe thermal mismatch between SiC and Cu and the limited heat tolerance of some SiC functional devices, there is a critical need to develop a low-temperature joining process for these two materials. In this work, a Cu particle-reinforced Sn58Bi filler was proposed to join magnetron-sputtered Cr/Cu-coated SiC with Cu at 190&#xa0;°C. The microstructure of SiC–Cu joint evolved from a coarse Sn-Bi eutectic (shear strength: ~ 10&#xa0;MPa) to a refined composite structure with dispersed Cu<sub>6</sub>Sn<sub>5</sub> intermetallic compounds (IMCs) when the content of added Cu was 1.32&#xa0;wt%, achieving a maximum strength of ~ 20&#xa0;MPa. This study reveals that the nano-sized Cu particles (500&#xa0;nm) accelerate Sn consumption, shifting the liquid composition of Sn58Bi filler away from its eutectic point and broadening the solidification range. Excessive Cu (1.96&#xa0;wt%) caused IMC aggregation and Bi segregation, analogous to the porosity threshold in porous metal-reinforced solders. Unlike continuous porous Cu frameworks, discrete Cu particles preferentially react with Sn, preserving the metallized Cu layer on SiC while enhancing phase boundary sliding during deformation.</p>

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Cu particle-reinforced Sn58Bi filler for soldering SiC to Cu at a temperature below 200 °C

  • 期刊论文

  • 发表日期：

    2025年6月27日

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  • Yu Zhao,
  • Yiteng Zhou,
  • Rajavaram Ramaraghavulu,
  • Gang Wang

摘要

Due to the severe thermal mismatch between SiC and Cu and the limited heat tolerance of some SiC functional devices, there is a critical need to develop a low-temperature joining process for these two materials. In this work, a Cu particle-reinforced Sn58Bi filler was proposed to join magnetron-sputtered Cr/Cu-coated SiC with Cu at 190 °C. The microstructure of SiC–Cu joint evolved from a coarse Sn-Bi eutectic (shear strength: ~ 10 MPa) to a refined composite structure with dispersed Cu6Sn5 intermetallic compounds (IMCs) when the content of added Cu was 1.32 wt%, achieving a maximum strength of ~ 20 MPa. This study reveals that the nano-sized Cu particles (500 nm) accelerate Sn consumption, shifting the liquid composition of Sn58Bi filler away from its eutectic point and broadening the solidification range. Excessive Cu (1.96 wt%) caused IMC aggregation and Bi segregation, analogous to the porosity threshold in porous metal-reinforced solders. Unlike continuous porous Cu frameworks, discrete Cu particles preferentially react with Sn, preserving the metallized Cu layer on SiC while enhancing phase boundary sliding during deformation.