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<p>The increasing popularity of electronic devices is placing higher demands on thermal management and electromagnetic interference shielding effectiveness. Based on the preparation process of three-dimensional (3D) ordered carbon skeleton, 3D graphene-based all-carbon foams with graphene, graphitized polyimide and graphite nanosheets (GNs) were constructed by cross-linking graphene oxide and GNs using polyamide acid. After compositing the 3D skeleton with PDMS, a bifunctional composite material with thermal conductivity and electromagnetic shielding properties was obtained, with thermal conductivity of 5.06&#xa0;W/(m⋅K), in addition to an electromagnetic shielding efficiency of 40.8&#xa0;dB for K-band. The 3D skeleton successfully combines graphene and the polymer substrate, avoiding the direct bonding that leads to lower heat transfer efficiency, and the fabricated PDMS/GGF materials exhibit excellent performance, making them ideal for applications in electronic devices that require EMI shielding and effective thermal management.</p> Graphical Abstract <p></p>

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Bifunctional 3D ordered graphene-based all-carbon foam/polymer composite materials for thermal management and electromagnetic shielding

  • 期刊论文

  • 发表日期：

    2025年6月2日

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  • Jianrui Yao,
  • Tingting Yang,
  • Cheng Ma,
  • Jitong Wang,
  • Ke Xiong,
  • Yinxu Zhang,
  • Wenming Qiao

摘要

The increasing popularity of electronic devices is placing higher demands on thermal management and electromagnetic interference shielding effectiveness. Based on the preparation process of three-dimensional (3D) ordered carbon skeleton, 3D graphene-based all-carbon foams with graphene, graphitized polyimide and graphite nanosheets (GNs) were constructed by cross-linking graphene oxide and GNs using polyamide acid. After compositing the 3D skeleton with PDMS, a bifunctional composite material with thermal conductivity and electromagnetic shielding properties was obtained, with thermal conductivity of 5.06 W/(m⋅K), in addition to an electromagnetic shielding efficiency of 40.8 dB for K-band. The 3D skeleton successfully combines graphene and the polymer substrate, avoiding the direct bonding that leads to lower heat transfer efficiency, and the fabricated PDMS/GGF materials exhibit excellent performance, making them ideal for applications in electronic devices that require EMI shielding and effective thermal management.

Graphical Abstract