<p>A surge in electronic device markets has generated considerable demand for thin-film microbatteries for practical usage in everyday electronics. Due to the accommodation constraints and safety issues of batteries that use liquid electrolytes, solid-state electrolytes are highly sought after. However, poor interfacial contacts and expansion strain-related mechanical failures are major setbacks for the direct implementation of solid-state batteries. Upon downsizing, i.e. fabrication in the 2D regime, the aforementioned issues can be easily addressed. Therefore, thin-film solid-state batteries are the most suited architecture for everyday electronics, IoT and medical implants. Several different techniques have been utilized to fabricate electrodes and solid electrolytes for all-solid-state thin-film batteries. However, the conventional techniques do not provide a platform to overcome challenges, such as particle agglomeration, formation of off-stoichiometric phases, and surface morphological inconsistencies. In this regard, RF magnetron sputtering stands out as the most adaptable deposition technique. RF sputtering provides a platform to fabricate a wide variety of materials, including conventional electrodes and solid-state electrolytes. In addition, it is possible to control the size, structure, composition and morphology easily by simply altering the synthesis parameters. RF sputtering is industrially scalable for fabricating large volumes of thin-film batteries as it serves as a facile method to engineer the electrodes, solid electrolytes and their interfaces. The present review focuses on the recent developments and prospects of cathode, electrolyte and anode material thin films grown via RF magnetron sputtering and their optimization for their potential application as commercial batteries for microelectronic devices.</p> Graphical Abstract <p></p>