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<p>Development of the high-power devices based on the third-generation semiconductor puts forward a high requirement for the thermal performance of electronic packaging materials. In this study, we employed oligomeric bismaleimide (BMI), multifunctional epoxy resin (EP), and 4.4’-daminodiphenylmethane (DDM) as the resin matrix to prepare a new BMI/EP/DDM (BED) ternary resin molding compound aiming for high-temperature electronic packaging. With 2-ethyl-4-methylimidazole as the curing accelerator, the reactions including the addition of BMI with DDM, addition of EP with DDM, self-polymerization of EP, and self-polymerization of BMI facilely occurred during the curing process of BED system, making the molding process of BED be compatible with that of commercial epoxy molding compounds (EMC). With increasing the BMI content, the thermal stability of the cured BED resins was improved, showing the initial thermal decomposition temperature and char yield at 800&#xa0;°C up to 388&#xa0;°C and 55.7%, respectively. Compared with EMC, the BED molding compounds exhibited a glass transition temperature over 360&#xa0;°C and a remarkable dimensional stability in the glassy state after curing, due to the enhancement of network chain rigidity by the introduction of BMI component. Although the cured BED was less ductile than the cured EMC at room temperature, showing lower flexural strength and higher flexural modulus, it had much superior flexural performance to the cured EMC at 250&#xa0;°C. Therefore, BED was demonstrated to be a promising candidate for high-temperature electronic packaging applications.</p> Graphical Abstract <p></p>

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Bismaleimide/epoxy/aromatic diamine ternary resin molding compounds for high-temperature electronic packaging applications

  • 期刊论文

  • 发表日期：

    2025年1月9日

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  • Feiyu Zhu,
  • Ying Bao,
  • Wei Hu,
  • Zhenzhen Li,
  • Xiaoma Fei,
  • Jingcheng Liu,
  • Xiaojie Li,
  • Wei Wei

摘要

Development of the high-power devices based on the third-generation semiconductor puts forward a high requirement for the thermal performance of electronic packaging materials. In this study, we employed oligomeric bismaleimide (BMI), multifunctional epoxy resin (EP), and 4.4’-daminodiphenylmethane (DDM) as the resin matrix to prepare a new BMI/EP/DDM (BED) ternary resin molding compound aiming for high-temperature electronic packaging. With 2-ethyl-4-methylimidazole as the curing accelerator, the reactions including the addition of BMI with DDM, addition of EP with DDM, self-polymerization of EP, and self-polymerization of BMI facilely occurred during the curing process of BED system, making the molding process of BED be compatible with that of commercial epoxy molding compounds (EMC). With increasing the BMI content, the thermal stability of the cured BED resins was improved, showing the initial thermal decomposition temperature and char yield at 800 °C up to 388 °C and 55.7%, respectively. Compared with EMC, the BED molding compounds exhibited a glass transition temperature over 360 °C and a remarkable dimensional stability in the glassy state after curing, due to the enhancement of network chain rigidity by the introduction of BMI component. Although the cured BED was less ductile than the cured EMC at room temperature, showing lower flexural strength and higher flexural modulus, it had much superior flexural performance to the cured EMC at 250 °C. Therefore, BED was demonstrated to be a promising candidate for high-temperature electronic packaging applications.

Graphical Abstract