Transductive zero-shot learning for mixed-type defect classification in wafer maps
摘要
In semiconductor manufacturing, rapidly identifying process faults through wafer map defect recognition can significantly improve production yield. However, annotating wafer map defect types—especially complex mixed-type defects—requires skilled technicians and substantial time, leading to high annotation costs. To address this issue, we present a transductive zero-shot learning method that classifies mixed-type defects using only labeled samples of single-type defects. The presented technique eliminates the need for labeled mixed-type defects by leveraging semantic information to bridge known classes (single-type) and unknown classes(mixed-type). This directly translates to reduced time and annotation costs, as well as faster process diagnosis in production environments. We introduce three key strategies to improve classification accuracy: (1) collaborative optimization of the visual feature extractor and semantic embedder, (2) iterative updating of the semantic space, and (3) progressive pseudo-labeling for retraining. Extensive experiments demonstrate that the proposed method substantially surpasses previous transductive zero-shot learning methods, particularly on mixed-type defects.