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<p>Deep eutectic solvents (DESs) have a wider electrochemical window than aqueous electrolytes, enabling the electrodeposition of metals such as Al, which cannot be electrodeposited using aqueous solutions. However, during electrodeposition in DES electrolytes, the plating quality obtained is low due to limited conductivity. This paper proposes a solution to this issue by adding NaCl to the previously studied AlCl₃-Urea DES and reports on the improvement in Al electrodeposition quality. The conductivity and plating efficiency of the DES were confirmed to improve with NaCl addition in the AlCl<sub>3</sub>-Urea electrolyte. The optimal electrolyte composition was determined to be Urea: AlCl<sub>3</sub>:NaCl = 1:1.7:0.3, with the highest plating efficiency achieved at -10&#xa0;mA cm<sup>− 2</sup>. Additionally, Raman spectroscopy confirmed ionic changes induced by NaCl, leading to a proposed electrochemical mechanism. Surface roughness analysis revealed that the smoothest deposited layer was obtained at -20&#xa0;mA cm<sup>− 2</sup>, indicating optimal nucleation and growth conditions at this current density. Electrochemical analysis was conducted to evaluate the effects of NaCl addition on plating properties. The study demonstrates that modifying AlCl<sub>3</sub>-Urea DES with NaCl effectively enhances conductivity, resulting in improved Al electrodeposition quality.</p> Graphical abstract <p></p>

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Characterization of the electrochemical deposition of AI from an AlCl3-urea deep eutectic solvent containing NaCl

  • 期刊论文

  • 发表日期：

    2025年10月5日

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  • JunYoung Lee,
  • Ye Ri Gwon,
  • Seil Kim,
  • Jooyul Lee,
  • JuYeong Lee,
  • Seunghoe Choe,
  • Pung Keun Song,
  • BungUk Yoo

摘要

Deep eutectic solvents (DESs) have a wider electrochemical window than aqueous electrolytes, enabling the electrodeposition of metals such as Al, which cannot be electrodeposited using aqueous solutions. However, during electrodeposition in DES electrolytes, the plating quality obtained is low due to limited conductivity. This paper proposes a solution to this issue by adding NaCl to the previously studied AlCl₃-Urea DES and reports on the improvement in Al electrodeposition quality. The conductivity and plating efficiency of the DES were confirmed to improve with NaCl addition in the AlCl3-Urea electrolyte. The optimal electrolyte composition was determined to be Urea: AlCl3:NaCl = 1:1.7:0.3, with the highest plating efficiency achieved at -10 mA cm− 2. Additionally, Raman spectroscopy confirmed ionic changes induced by NaCl, leading to a proposed electrochemical mechanism. Surface roughness analysis revealed that the smoothest deposited layer was obtained at -20 mA cm− 2, indicating optimal nucleation and growth conditions at this current density. Electrochemical analysis was conducted to evaluate the effects of NaCl addition on plating properties. The study demonstrates that modifying AlCl3-Urea DES with NaCl effectively enhances conductivity, resulting in improved Al electrodeposition quality.

Graphical abstract