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<p>With the advancement of the information age, ultra-thin copper foil used in lithium-ion batteries demands higher mechanical strength and lower surface roughness, making these two factors a key constraint for the progress of the entire lithium battery industry. The production of ultra-thin, tensile-resistant electroplated copper foil with only trace additives presents significant technical challenges. In this study, four quaternary ammonium salts based on acridone were synthesized and evaluated as levelers for copper electroplating. Electrochemical assays and molecular dynamics simulations revealed that quaternary ammonium salt synthesized from acridone and 4-diaminopyridine ADT-DMAP demonstrated the most effective cathodic adsorption and suppression among the compounds tested. Scanning Electron Microscopy, X-ray Diffraction, Electron Backscatter Diffraction, and Atomic Force Microscopy analyses confirmed that ADT-DMAP exhibited exceptional leveling performance in electroplating, enabling the production of ultra-thin copper foils with smooth surfaces and enhanced tensile strength. Furthermore, the leveling mechanism of ADT-DMAP and its synergistic interaction with SPS were analyzed using electrostatic potential and average local ionization energy calculations.</p> Graphical abstract <p></p>

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Mechanistic insights into enhanced electroplating of ultra-thin copper foils using ADT-DMAP as a superior acridone-based leveler

  • 期刊论文

  • 发表日期：

    2025年2月6日

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  • Jingyu Xie,
  • Nayun Zhou,
  • Wenlong Ye,
  • Xin Chen,
  • Limin Wang

摘要

With the advancement of the information age, ultra-thin copper foil used in lithium-ion batteries demands higher mechanical strength and lower surface roughness, making these two factors a key constraint for the progress of the entire lithium battery industry. The production of ultra-thin, tensile-resistant electroplated copper foil with only trace additives presents significant technical challenges. In this study, four quaternary ammonium salts based on acridone were synthesized and evaluated as levelers for copper electroplating. Electrochemical assays and molecular dynamics simulations revealed that quaternary ammonium salt synthesized from acridone and 4-diaminopyridine ADT-DMAP demonstrated the most effective cathodic adsorption and suppression among the compounds tested. Scanning Electron Microscopy, X-ray Diffraction, Electron Backscatter Diffraction, and Atomic Force Microscopy analyses confirmed that ADT-DMAP exhibited exceptional leveling performance in electroplating, enabling the production of ultra-thin copper foils with smooth surfaces and enhanced tensile strength. Furthermore, the leveling mechanism of ADT-DMAP and its synergistic interaction with SPS were analyzed using electrostatic potential and average local ionization energy calculations.

Graphical abstract