3D fabrication of complex copper microstructures with path planning by localized electrochemical deposition

Although additive manufacturing technology has been widely applied in metal processing and forming due to its significant technical advantages, the precision rapid prototyping of microscale three-dimensional metal components remains a challenge. Localized electrochemical deposition has shown distinct advantages in the fabrication of microscale components by reducing metal ions to form the desired structures. Specifically, we optimized the surface morphology of the deposited copper micropillars by varying the deposition voltage, adding sulfuric acid and polyethylene glycol to the electrolyte. Furthermore, we fabricated structurally diverse three-dimensional microscale complex structures without support, such as “fencings,” “artistic gymnastics,” and overhanging structures, by planning the movement path of the micro-anode during the deposition. Lastly, we studied the effect of different horizontal gaps on the micropillar arrays and achieved satisfactory hydrophobic functional surfaces. These studies provide insights into the precision rapid prototyping of microscale metal components and will promote the application of localized electrochemical deposition in the engineering field.