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<p>Graphene-based films are promising for advanced thermal management, yet achieving high thermal conductivity typically requires energy-intensive, high-temperature annealing. Herein, we report a systematic study on tuning the structural and transport properties of partially reduced graphene oxide (PRGO) films through the incorporation of polymer additives followed by moderate temperature (1000&#xa0;°C) annealing. Three polymers including chitosan (CS), polyimide (PI), and polydopamine (PDA) are investigated. Structural characterization (SEM, XRD, Raman, XPS) reveals that CS reduces defect density after thermal annealing at 1000 °C. Thermal characterization indicates that all additives improve thermal diffusivity, but only CS increases film density, resulting in a net rise in thermal conductivity. For electrical conductivity, CS markedly boosts conductivity, while PI and PDA degrade it. These property trends remain consistent from 10 to 320&#xa0;K. Analysis of the temperature coefficient of resistance (TCR) indicates a significantly reduced TCR for the modified film (0.01–0.02%·K⁻<sup>1</sup>), nearing the value of pristine graphene (0.02–0.05% K<sup>−1</sup> at 260–350&#xa0;K). Furthermore, low-temperature thermal reffusivity analysis confirms that the polymer additives suppress phonon-defect scattering and enlarge structural domains, with PI uniquely strengthening interatomic bonding. Our results demonstrate that CS is a particularly effective additive for concurrently enhancing both thermal and electrical performance in PRGO films, providing a viable polymer-mediated route for microstructure-engineered graphene-based materials.</p>

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Enhancing Thermal Transport in Partially Reduced Graphene Oxide Films: A Comparative Study of Polymeric Additives

  • 期刊论文

  • 发表日期：

    2026年2月25日

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  • Shuyi Lv,
  • Weihao Chen,
  • Tingting Chen,
  • Yuting Fang,
  • Yangsu Xie

摘要

Graphene-based films are promising for advanced thermal management, yet achieving high thermal conductivity typically requires energy-intensive, high-temperature annealing. Herein, we report a systematic study on tuning the structural and transport properties of partially reduced graphene oxide (PRGO) films through the incorporation of polymer additives followed by moderate temperature (1000 °C) annealing. Three polymers including chitosan (CS), polyimide (PI), and polydopamine (PDA) are investigated. Structural characterization (SEM, XRD, Raman, XPS) reveals that CS reduces defect density after thermal annealing at 1000 °C. Thermal characterization indicates that all additives improve thermal diffusivity, but only CS increases film density, resulting in a net rise in thermal conductivity. For electrical conductivity, CS markedly boosts conductivity, while PI and PDA degrade it. These property trends remain consistent from 10 to 320 K. Analysis of the temperature coefficient of resistance (TCR) indicates a significantly reduced TCR for the modified film (0.01–0.02%·K⁻1), nearing the value of pristine graphene (0.02–0.05% K−1 at 260–350 K). Furthermore, low-temperature thermal reffusivity analysis confirms that the polymer additives suppress phonon-defect scattering and enlarge structural domains, with PI uniquely strengthening interatomic bonding. Our results demonstrate that CS is a particularly effective additive for concurrently enhancing both thermal and electrical performance in PRGO films, providing a viable polymer-mediated route for microstructure-engineered graphene-based materials.