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<p>The slow cooling of ladle slag during copper smelting offers broad potential for recovering valuable metals. Thermal conductivity is a key parameter influencing the slag’s cooling rate. However, limited research on the thermal conductivity of copper slag constrains the development of effective cooling strategies. This study systematically investigates the effects of temperature, chemical composition, and microstructure on the thermal conductivity of the SiO<sub>2</sub>–FeO–Al<sub>2</sub>O<sub>3</sub>–MgO–CaO-based copper slag using laser flash analysis. As the slag cooled from 1523&#xa0;K to 1398&#xa0;K, 723&#xa0;K, and 323&#xa0;K, the corresponding thermal conductivities were 0.3594, 0.8046, 0.7085, and 0.9388 W/(m·K), respectively. Increasing SiO<sub>2</sub> (from 31.44 wt.% to 45 wt.%) and Al<sub>2</sub>O<sub>3</sub> (from 4.24 wt.% to 12 wt.%) promoted melt polymerization, enhancing thermal conductivity at 1523&#xa0;K by 27–63% and 4–26&#xa0;%, respectively. By contrast, increasing the Fe/SiO2 ratio (from 1.25 to 1.6) and CaO content (from 2.88 wt.% to 11 wt.%) induced depolymerization, decreasing thermal conductivity by 7–34% and 4–10%, respectively. Increasing MgO content (from 3.1 wt.% to 11 wt.%) elevated the melting point, improving thermal conductivity by 1–37&#xa0;%. The impact of the crystallization of copper slag by increasing the content of SiO<sub>2</sub>, Al<sub>2</sub>O<sub>3</sub>, MgO, and CaO resulted in a decrease in thermal conductivity of solid slag by 4–31&#xa0;%, whereas FeO allowed an increase in thermal conductivity by 12–88&#xa0;%. These findings provide a theoretical basis for optimizing the cooling process of copper slag in industrial applications.</p>

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Investigation on the Thermal Conductivity of the Molten Copper Slag Cooling and Solidification Process

  • 期刊论文

  • 发表日期：

    2025年8月29日

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  • Siyu Chen,
  • Ruijin Fan,
  • Ruinan Zhu,
  • Jianhang Hu,
  • Hua Wang

摘要

The slow cooling of ladle slag during copper smelting offers broad potential for recovering valuable metals. Thermal conductivity is a key parameter influencing the slag’s cooling rate. However, limited research on the thermal conductivity of copper slag constrains the development of effective cooling strategies. This study systematically investigates the effects of temperature, chemical composition, and microstructure on the thermal conductivity of the SiO2–FeO–Al2O3–MgO–CaO-based copper slag using laser flash analysis. As the slag cooled from 1523 K to 1398 K, 723 K, and 323 K, the corresponding thermal conductivities were 0.3594, 0.8046, 0.7085, and 0.9388 W/(m·K), respectively. Increasing SiO2 (from 31.44 wt.% to 45 wt.%) and Al2O3 (from 4.24 wt.% to 12 wt.%) promoted melt polymerization, enhancing thermal conductivity at 1523 K by 27–63% and 4–26 %, respectively. By contrast, increasing the Fe/SiO2 ratio (from 1.25 to 1.6) and CaO content (from 2.88 wt.% to 11 wt.%) induced depolymerization, decreasing thermal conductivity by 7–34% and 4–10%, respectively. Increasing MgO content (from 3.1 wt.% to 11 wt.%) elevated the melting point, improving thermal conductivity by 1–37 %. The impact of the crystallization of copper slag by increasing the content of SiO2, Al2O3, MgO, and CaO resulted in a decrease in thermal conductivity of solid slag by 4–31 %, whereas FeO allowed an increase in thermal conductivity by 12–88 %. These findings provide a theoretical basis for optimizing the cooling process of copper slag in industrial applications.