Investigate the mechanical properties of Cu-SiO₂ nanocomposite via powder metallurgy

The paper proposed the methodology for research findings on developing a Cu-SiO₂ sintered composite produced by powder metallurgy. In a copper matrix, SiO₂ particles were added in concentrations of 5%, 7.5%and 10%. Mixtures of finished powders were pressed with a crushing pressure of 620 MPa using a single press and then applied to sintering processes in the dissociated ammonia atmosphere at 910 °C. It was 65 min for sintering. Sintered compact specimens were tested for electrical conductivity, wear resistance, density and hardness. A composite comprising 5% SiO₂, which was 7.94 g/cm³, obtained the maximum density. A composite with 10% SiO₂ corresponds to 50 HB, and the maximum hardness was achieved. The highest electrical conductivity was 59 MS/m for the composite containing 5% SiO₂. The greater abrasive wear resistance strength was achieved by 10% SiO₂ composite. Along with the rise of composite SiO2, the density and electric conductivity have decreased.