Non-Fourier heat conduction induced thermal shock fracture behavior of multi-crack auxetic honeycomb structures

The investigation of non-Fourier thermal shock fracture behavior in multi-crack auxetic honeycomb structures (HSs) is presented. By employing a non-Fourier heat conduction model, the corresponding temperature and thermal stress fields are established. Subsequently, a thermal stress intensity factor (TSIF) model for the auxetic HSs, accounting for multi-crack interactions, is developed. Finally, using the fracture-based failure criterion, the non-Fourier multi-crack critical temperature of the auxetic HSs is determined. This investigation thoroughly examines the effects of the non-Fourier effect (NFE), auxetic property, crack spacing, and crack location on the thermal shock fracture behavior of the auxetic HSs. Results indicate that a stronger NFE leads to weaker thermal shock resistance in auxetic HSs. Regardless of the presence of the NFE, the auxetic property consistently increases the multi-crack critical temperature of the HSs. Additionally, the interaction of multi-crack inhibits thermal shock crack propagation in HSs.