Scholarlink

<p>Multilayered structures, porous materials, and heterogeneous composites are widely used in aerospace, advanced electronics, and energy systems. Their thermal transport behavior is jointly governed by multiscale structural features, including interfaces, pores, cracks, defects, and component distributions, making traditional homogenization models inadequate for accurately describing the transfer of microscopic mechanisms to macroscopic thermal responses. Focusing on the multiscale modeling of thermal transport in complex materials, this review systematically elucidates the coupling relationships among phonon scattering, interfacial impediments, mesoscopic structural regulation, and macroscopic effective thermal properties. Recent advances and applicability boundaries of analytical models, thermal resistance networks, numerical simulations, molecular dynamics, image-reconstruction-based modeling, and artificial intelligence methods are summarized. Particular emphasis is placed on the cross-scale correlation between interfacial thermal resistance and effective thermal conductivity. Interfacial thermal resistance characterizes the local impediment to energy transfer, whereas effective thermal conductivity reflects the integrated macroscopic outcome of interfacial effects, structural characteristics, and heat-flow path reconstruction. On this basis, scale coupling strategies, representative volume element selection, homogenization methods, simulation and experimental characterization of interfacial thermal resistance, as well as the roles of data standardization, uncertainty quantification, and sensitivity analysis in supporting model credibility are further discussed. Finally, key challenges are summarized, including accurate characterization of complex structures, dynamic multi-field coupling, cross-scale parameter transfer, and computational efficiency. Future directions are also outlined, including physics-constrained artificial intelligence, multi-fidelity modeling, digital twins, and coupled analysis under extreme service environments. This review aims to provide useful references for the design, performance prediction, and engineering thermal management of complex thermal functional materials.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Advances in Multiscale Modeling of Thermal Transport in Multilayered Structures, Porous Materials, and Heterogeneous Composites

  • 期刊论文

  • 发表日期：

    2026年6月27日

查看全文
  • Weiwei Liu,
  • Weicheng Kong,
  • Lihong Dong,
  • Haidou Wang,
  • Kaixuan Li,
  • Pengfei Kong,
  • Chengyang Shen

摘要

Multilayered structures, porous materials, and heterogeneous composites are widely used in aerospace, advanced electronics, and energy systems. Their thermal transport behavior is jointly governed by multiscale structural features, including interfaces, pores, cracks, defects, and component distributions, making traditional homogenization models inadequate for accurately describing the transfer of microscopic mechanisms to macroscopic thermal responses. Focusing on the multiscale modeling of thermal transport in complex materials, this review systematically elucidates the coupling relationships among phonon scattering, interfacial impediments, mesoscopic structural regulation, and macroscopic effective thermal properties. Recent advances and applicability boundaries of analytical models, thermal resistance networks, numerical simulations, molecular dynamics, image-reconstruction-based modeling, and artificial intelligence methods are summarized. Particular emphasis is placed on the cross-scale correlation between interfacial thermal resistance and effective thermal conductivity. Interfacial thermal resistance characterizes the local impediment to energy transfer, whereas effective thermal conductivity reflects the integrated macroscopic outcome of interfacial effects, structural characteristics, and heat-flow path reconstruction. On this basis, scale coupling strategies, representative volume element selection, homogenization methods, simulation and experimental characterization of interfacial thermal resistance, as well as the roles of data standardization, uncertainty quantification, and sensitivity analysis in supporting model credibility are further discussed. Finally, key challenges are summarized, including accurate characterization of complex structures, dynamic multi-field coupling, cross-scale parameter transfer, and computational efficiency. Future directions are also outlined, including physics-constrained artificial intelligence, multi-fidelity modeling, digital twins, and coupled analysis under extreme service environments. This review aims to provide useful references for the design, performance prediction, and engineering thermal management of complex thermal functional materials.