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<p>Multilayer thin-film structures are ubiquitous in electronic packaging engineering, where fracture and interfacial delamination represent major failure modes and have become a central focus of research. In this study, a modified phase-field fracture model (PFM) is developed to systematically investigate crack propagation and interface debonding behavior in the cross-sectional nano-indentation (CSN) test. In the model, a phase-field variable and several interface-field variables are introduced to describe the crack and interfaces, respectively. Furthermore, an equivalent critical energy release rate is incorporated to capture the influence of interfaces on crack evolution. The predicted crack path agrees well with both experimental observations from the CSN test and numerical results of peridynamic simulations, which validate the effectiveness of the proposed model. The numerical results indicate that interface characteristics, particularly fracture toughness, play a significant role in determining the crack path and failure mode. The developed phase-field model provides an efficient and reliable tool for investigating mechanical failure mechanisms, evaluating interface reliability, and guiding the optimal design of multi-material and multi-interface structures in microelectronic systems.</p>

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Phase-Field Modeling of Crack Propagation in Multilayer Thin-Film Structures for Electronic Packaging

  • 期刊论文

  • 发表日期：

    2026年7月14日

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  • Xinyi Luo,
  • Xin Zhang,
  • Yanwei Dai,
  • Tao Wang,
  • Haidong Fan,
  • Peidong Li

摘要

Multilayer thin-film structures are ubiquitous in electronic packaging engineering, where fracture and interfacial delamination represent major failure modes and have become a central focus of research. In this study, a modified phase-field fracture model (PFM) is developed to systematically investigate crack propagation and interface debonding behavior in the cross-sectional nano-indentation (CSN) test. In the model, a phase-field variable and several interface-field variables are introduced to describe the crack and interfaces, respectively. Furthermore, an equivalent critical energy release rate is incorporated to capture the influence of interfaces on crack evolution. The predicted crack path agrees well with both experimental observations from the CSN test and numerical results of peridynamic simulations, which validate the effectiveness of the proposed model. The numerical results indicate that interface characteristics, particularly fracture toughness, play a significant role in determining the crack path and failure mode. The developed phase-field model provides an efficient and reliable tool for investigating mechanical failure mechanisms, evaluating interface reliability, and guiding the optimal design of multi-material and multi-interface structures in microelectronic systems.