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<p>Mini light-emitting diodes (Mini-LEDs) show great application potential in high-end displays owing to their superior pixel density, brightness, responsiveness, and efficiency. However, current packaging materials for Mini-LEDs are predominantly thermally cured, which is energy- and time-consuming and can adversely affect electronic components. In this study, a novel UV-curable silicone resin containing phenyl, disulfide, and acryloyl groups (SPASR) is developed from commercially available siloxanes. The resin exhibits a refractive index (<i>n</i><sub>d</sub>) higher than 1.5, and it can be cured within 30 s under UV irradiation. After curing, it exhibits an optical transparency exceeding 92%, a lap adhesion strength of up to 1.84 MPa, and good thermostability (<i>T</i><sub>5%</sub>&gt;265 °C). Notably, the volume shrinkage is less than 4.83%, attributed to the release of photopolymerization stress <i>via</i> UV-induced disulfide metathesis during UV curing. Mini-LEDs encapsulated with this resin show luminescence properties comparable to those of conventional thermally-cured sealants, and show excellent sealability wihtout visible penetration after being immersed in red ink for 12 h. Consequently, these excellent properties make the SPASR resin an ideal candidate for microelectronic encapsulation, offering a more reliable and efficient solution for the electronics industry.</p>

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UV-curable, Transparent, and Low Volume-shrinkage Silicones for Efficient Mini-LED Encapsulation

  • 期刊论文

  • 发表日期：

    2026年1月22日

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  • Zi-Hua Zhang,
  • Juan Ye,
  • Wei-Shan Wen,
  • Qing-Hong Luo,
  • Hong-Ping Xiang

摘要

Mini light-emitting diodes (Mini-LEDs) show great application potential in high-end displays owing to their superior pixel density, brightness, responsiveness, and efficiency. However, current packaging materials for Mini-LEDs are predominantly thermally cured, which is energy- and time-consuming and can adversely affect electronic components. In this study, a novel UV-curable silicone resin containing phenyl, disulfide, and acryloyl groups (SPASR) is developed from commercially available siloxanes. The resin exhibits a refractive index (nd) higher than 1.5, and it can be cured within 30 s under UV irradiation. After curing, it exhibits an optical transparency exceeding 92%, a lap adhesion strength of up to 1.84 MPa, and good thermostability (T5%>265 °C). Notably, the volume shrinkage is less than 4.83%, attributed to the release of photopolymerization stress via UV-induced disulfide metathesis during UV curing. Mini-LEDs encapsulated with this resin show luminescence properties comparable to those of conventional thermally-cured sealants, and show excellent sealability wihtout visible penetration after being immersed in red ink for 12 h. Consequently, these excellent properties make the SPASR resin an ideal candidate for microelectronic encapsulation, offering a more reliable and efficient solution for the electronics industry.