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<p>Polyimide (PI) is widely used in high-tech fields such as microelectronics, aerospace, and national defense because of its excellent optical properties, high- and low-temperature resistance, and good dimensional stability. To achieve the desired properties of PI, the monomers 2,6-diaminopyrimidin-4-ol (DAPD) and 6-(2,3,5,6-tetrafluoro-4-vinylphenoxy) pyrimidin-2,4-diamine (DAFPD), which contains crosslinkable functional groups, were designed and synthesized successfully and copolymerized with 4,4′-oxydianiline (ODA) and 4,4-hexafluoroisopropylphthalic anhydride (6FDA). The prepared PI film (PI-3), with rigid backbones and loose packing had excellent heat resistance (<i>T</i><sub>d5%</sub>=489 °C) and optical properties (<i>T</i><sub>450</sub>=82%). Furthermore, a crosslinked PI film (c-PI-3) with more heat-resistant (<i>T</i><sub>d5%</sub>=524 °C) and better mechanical properties (σ=125.46 MPa), can be obtained through thermal crosslinking of tetrafluorostyrene. In addition, the changes in the properties caused by the proportion of DAFPD added during copolymerization are discussed comprehensively. This study provides a promising candidate for heat-resistant PI materials.</p>

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Synthesis and Properties of Heat-resistant Polyimides Films Containing Crosslinkable Group-tetrafluorostyrene

  • 期刊论文

  • 发表日期：

    2025年4月3日

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  • Tian-Yong Zhang,
  • Jia-Ning Yu,
  • Sui-Sui Wang,
  • Ya-Mei Chai,
  • Shuang Jiang,
  • Hong-Li An,
  • Ruo-Xi Sun,
  • Bin Li

摘要

Polyimide (PI) is widely used in high-tech fields such as microelectronics, aerospace, and national defense because of its excellent optical properties, high- and low-temperature resistance, and good dimensional stability. To achieve the desired properties of PI, the monomers 2,6-diaminopyrimidin-4-ol (DAPD) and 6-(2,3,5,6-tetrafluoro-4-vinylphenoxy) pyrimidin-2,4-diamine (DAFPD), which contains crosslinkable functional groups, were designed and synthesized successfully and copolymerized with 4,4′-oxydianiline (ODA) and 4,4-hexafluoroisopropylphthalic anhydride (6FDA). The prepared PI film (PI-3), with rigid backbones and loose packing had excellent heat resistance (Td5%=489 °C) and optical properties (T450=82%). Furthermore, a crosslinked PI film (c-PI-3) with more heat-resistant (Td5%=524 °C) and better mechanical properties (σ=125.46 MPa), can be obtained through thermal crosslinking of tetrafluorostyrene. In addition, the changes in the properties caused by the proportion of DAFPD added during copolymerization are discussed comprehensively. This study provides a promising candidate for heat-resistant PI materials.