On the reliability of HfO2-based FeFETs for memory applications
摘要
This research examines the reliability of Ferroelectric Field Effect Transistors (FeFETs) under electrical stress on memory window performance. Comparative analysis of Single-Metal Gate FeFETs (SMG-FeFETs) and Dual-Metal Gate FeFETs (DMG-FeFETs) was performed using well calibrated simulation deck. The DMG-FeFET architecture showed a 21% increase in memory window over standard SMG-FeFET structures. Moreover, the DMG-FeFET architecture demonstrates better stability through multiple reliability figures, such as temperature fluctuation, trap energy levels, interface trap density, and integration bias time. Engineering of work function in the DMG-FeFET brings about a step potential profile with screening gate protecting the degradation in the memory window from drain-induced detrapping effects by shielding the channel effectively under long integration times. These results evince superior reliability of DMG-FeFETs especially applicable to automotive electronics, industrial control systems, IoT devices, and embedded non-volatile memories where stable performance across different operating conditions is a necessity.