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<p>Electrochemical spark micromilling (ECSMM) is an effective advanced hybrid micromachining technique for fabricating microchannels in non-conducting materials used for MEMs, sensors, microactuators, microcantilevers, and microelectronics. This study investigates the influence of key parameters on fabrication of microchannels having 2000&#xa0;mm length on neat epoxy (NE) and silica nanoparticle-reinforced epoxy nanocomposites (SRENC) workpieces using a one-factor-at-a-time (OFAT) approach. Parameters such as voltage, tool rotational speed, T<sub>on</sub>–T<sub>off</sub> time, electrolyte concentration, and silica particle concentration were examined for their effects on material removal rate (MRR), surface roughness (R<sub>a</sub>) and geometrical aspects. The mean MRR and R<sub>a</sub> for the NE polymer were determined to be 0.4519&#xa0;mg and 7.404&#xa0;µm, respectively. In contrast, the mean MRR and R<sub>a</sub> for SRENC at 1%, 2%, and 3% concentration&#xa0;were 0.4152&#xa0;mg and 6.021&#xa0;µm, 0.3431&#xa0;mg and 7.806&#xa0;µm, and 0.3549&#xa0;mg and 8.566&#xa0;µm, respectively. The results indicate that the addition of silica reinforcement often lowers the MRR in comparison to NE polymer. 3% silica-reinforced nanocomposite shows the highest MRR among the reinforced samples with an improvement in surface quality and microchannel geometry. SEM study shows melted material deposition and inconsistency in straightness of microchannels, which is higher in NE polymer than SRENC. Mean microchannel widths at 3% SRENC are 13.69% better than those at 1% SRENC and 2.34% better than those at 2% SRENC. Compared to 1% and 2% SRENC, the mean depth of the microchannel improved on 3% SRENC&#xa0;and is 0.516&#xa0;mm.</p>

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Performance analysis of electrochemical spark micromilling (ECSMM) process for microchannel fabrication on SiO2-reinforced epoxy nanocomposite

  • 期刊论文

  • 发表日期：

    2025年2月24日

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  • Kriti Sahai,
  • Audhesh Narayan

摘要

Electrochemical spark micromilling (ECSMM) is an effective advanced hybrid micromachining technique for fabricating microchannels in non-conducting materials used for MEMs, sensors, microactuators, microcantilevers, and microelectronics. This study investigates the influence of key parameters on fabrication of microchannels having 2000 mm length on neat epoxy (NE) and silica nanoparticle-reinforced epoxy nanocomposites (SRENC) workpieces using a one-factor-at-a-time (OFAT) approach. Parameters such as voltage, tool rotational speed, Ton–Toff time, electrolyte concentration, and silica particle concentration were examined for their effects on material removal rate (MRR), surface roughness (Ra) and geometrical aspects. The mean MRR and Ra for the NE polymer were determined to be 0.4519 mg and 7.404 µm, respectively. In contrast, the mean MRR and Ra for SRENC at 1%, 2%, and 3% concentration were 0.4152 mg and 6.021 µm, 0.3431 mg and 7.806 µm, and 0.3549 mg and 8.566 µm, respectively. The results indicate that the addition of silica reinforcement often lowers the MRR in comparison to NE polymer. 3% silica-reinforced nanocomposite shows the highest MRR among the reinforced samples with an improvement in surface quality and microchannel geometry. SEM study shows melted material deposition and inconsistency in straightness of microchannels, which is higher in NE polymer than SRENC. Mean microchannel widths at 3% SRENC are 13.69% better than those at 1% SRENC and 2.34% better than those at 2% SRENC. Compared to 1% and 2% SRENC, the mean depth of the microchannel improved on 3% SRENC and is 0.516 mm.