Multi-field coupled vibration analysis of sandwich piezoelectric semiconductor cylindrical shells under thermal loading
摘要
In this paper, the free vibration characteristics of a laminated piezoelectric semiconductor (PS) cylindrical shell are investigated based on first-order shear deformation theory. The strain energy, kinetic energy, and virtual work of the system are formulated through the constitutive equations and geometric relations of the laminated PS shell. By applying Hamilton’s principle, the governing equations for the vibrations are derived, and then the analytical solutions for the vibration responses of simply supported laminated PS cylindrical shells are presented. Numerical case studies are used to examine the influence of the initial electron concentration, thermal load, and geometric parameters on the natural frequencies and damping behavior of the shell. The coupling mechanisms among the deformation, polarization, and charge carriers in a multi-physics context are elucidated. The results indicate that thermal effects exert a negligible impact on the natural frequencies and damping of the laminated PS cylindrical shell, whereas the damping characteristics demonstrate a pronounced size dependence.