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<p>Sn-2.5Ag-0.8Cu-0.5Sb (SAC-0.5Sb), Sn-2.5Ag-0.8Cu-1.5In (SAC-1.5In), and Sn-2.5Ag-0.8Cu-1.5Zn (SAC-1.5Zn) solder alloys were prepared by induction melting using high-purity Sn, Ag, Cu, Sb, In, and Zn. The microstructure characteristics, thermal behavior, and tensile stress-strain were investigated. Thermal analysis measurements of the synthesized alloys show lower values than those of the Sn-Ag and Sn-Ag-Cu solder systems. The measured melting points of SAC-0.5Sb, SAC-1.5In, and SAC-1.5Zn are 213.2&#xa0;°C, 208.75&#xa0;°C, and 214.15&#xa0;°C, respectively. Stress-strain curves were obtained at different testing temperatures and strain rates. Plateau curves’ behaviors reflect the competing effects of work hardening and dynamic recovery. The yield stress (σ<sub>Y</sub>) decreases with increasing testing temperature. In addition, Young modulus (E), yield stress, and ultimate tensile stress (σ<sub>UTS</sub>) rise with increasing strain rate. Ductility (El%) depends on temperature and strain rate. The ductility of SAC-0.5Sb, SAC-1.5In, and SAC-1.5Zn solder alloys increases from 38% to 48%, 43% to 64%, and 27% to 37%, respectively, as the testing temperature rises from 50 to 130&#xa0;°C. The enhancement of the tensile parameters (i.e., E, σ<sub>Y</sub>, σ<sub>UTS</sub>, and El%) was attributed to the modifications in the microstructure. Activation energy (Q), strain rate sensitivity, and stress exponent (<i>n</i>) are key parameters for determining the deformation mechanism in plastic deformation. The Garofalo rule was applied to estimate the stress exponents (<i>n</i>) for SAC-0.5Sb, SAC-1.5In, and SAC-1.5Zn alloys, which were found to be 7.91, 6.52, and 7.89, respectively. Moreover, the activation energy (Q) values for SAC-0.5Sb, SAC-1.5In, and SAC-1.5Zn alloys are 50.6, 47.3, and 64.8&#xa0;kJ/mol, respectively.</p>

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Effect of additions Sb, In, and Zn on the thermal behavior, microstructure, and tensile properties of Sn-2.5Ag-0.8Cu solder alloy

  • 期刊论文

  • 发表日期：

    2026年6月22日

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  • A. N. Fouda,
  • Gaber El-Enany,
  • E. A. Eid

摘要

Sn-2.5Ag-0.8Cu-0.5Sb (SAC-0.5Sb), Sn-2.5Ag-0.8Cu-1.5In (SAC-1.5In), and Sn-2.5Ag-0.8Cu-1.5Zn (SAC-1.5Zn) solder alloys were prepared by induction melting using high-purity Sn, Ag, Cu, Sb, In, and Zn. The microstructure characteristics, thermal behavior, and tensile stress-strain were investigated. Thermal analysis measurements of the synthesized alloys show lower values than those of the Sn-Ag and Sn-Ag-Cu solder systems. The measured melting points of SAC-0.5Sb, SAC-1.5In, and SAC-1.5Zn are 213.2 °C, 208.75 °C, and 214.15 °C, respectively. Stress-strain curves were obtained at different testing temperatures and strain rates. Plateau curves’ behaviors reflect the competing effects of work hardening and dynamic recovery. The yield stress (σY) decreases with increasing testing temperature. In addition, Young modulus (E), yield stress, and ultimate tensile stress (σUTS) rise with increasing strain rate. Ductility (El%) depends on temperature and strain rate. The ductility of SAC-0.5Sb, SAC-1.5In, and SAC-1.5Zn solder alloys increases from 38% to 48%, 43% to 64%, and 27% to 37%, respectively, as the testing temperature rises from 50 to 130 °C. The enhancement of the tensile parameters (i.e., E, σY, σUTS, and El%) was attributed to the modifications in the microstructure. Activation energy (Q), strain rate sensitivity, and stress exponent (n) are key parameters for determining the deformation mechanism in plastic deformation. The Garofalo rule was applied to estimate the stress exponents (n) for SAC-0.5Sb, SAC-1.5In, and SAC-1.5Zn alloys, which were found to be 7.91, 6.52, and 7.89, respectively. Moreover, the activation energy (Q) values for SAC-0.5Sb, SAC-1.5In, and SAC-1.5Zn alloys are 50.6, 47.3, and 64.8 kJ/mol, respectively.