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<p>Conventional oil-based electrical interface materials (OEIMs) suffer from severe degradation over time, leading to discontinuous contact networks. This elevated contact resistance and detrimental heat accumulation in high-power systems. To overcome these limitations, this study proposes a novel metal-based electrical interface material (MEIM) formulated by incorporating CuGa<sub>2</sub> particles into a room-temperature eutectic gallium-indium (EGaIn) matrix. The EGaIn@CuGa<sub>2</sub> composites are prepared using a room-temperature grinding process. The EGaIn@CuGa<sub>2</sub> composite leverages exceptional intermetallic wetting to achieve good dispersion. The optimized 40 wt% CuGa<sub>2</sub> formulation undergoes a rheological transition into a thixotropic paste, establishing an internal percolation network while maintaining high electrical conductivity and excellent interfacial conformability. Systematic evaluations reveal that the MEIM significantly outperforms conventional OEIMs and unfilled joints. Under a 1.6&#xa0;N·m clamping torque, the MEIM reduces the static contact resistance of graphite–graphite (C–C) and graphite–copper (C–Cu) joints by 15.3% and 13.0%, respectively, compared to unfilled baselines. At a 20&#xa0;A DC current, the steady-state temperature at the C–MEIM–C joint is approximately 7&#xa0;°C lower than that at the C–OEIM–C joint, and the steady-state temperature of the C–MEIM–Cu joint is approximately 6&#xa0;°C lower than that of the C–OEIM–Cu joint. Furthermore, in dynamic current-carrying sliding tests, the MEIM-coated interface demonstrates exceptional stability, maintaining a contact resistance below 0.1 Ω with negligible fluctuations, in stark contrast to the erratic surges (~ 1.3 Ω) observed during dry sliding. By combining internal metallic bonding with interfacial physical adhesion, the MEIM ensures continuous, low-resistance pathways. This advantage highlights its substantial potential as a reliable alternative to OEIMs for high-power-density and long-life electrical interconnections.</p>

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EGaIn@CuGa2 electrical interface materials for graphite joint interconnections: preparation, performance, and reliability

  • 期刊论文

  • 发表日期：

    2026年3月23日

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  • Jiasheng Zu,
  • Wentao Xiang,
  • Guanghao Sang,
  • Yuntao Cui,
  • Zhongshan Deng

摘要

Conventional oil-based electrical interface materials (OEIMs) suffer from severe degradation over time, leading to discontinuous contact networks. This elevated contact resistance and detrimental heat accumulation in high-power systems. To overcome these limitations, this study proposes a novel metal-based electrical interface material (MEIM) formulated by incorporating CuGa2 particles into a room-temperature eutectic gallium-indium (EGaIn) matrix. The EGaIn@CuGa2 composites are prepared using a room-temperature grinding process. The EGaIn@CuGa2 composite leverages exceptional intermetallic wetting to achieve good dispersion. The optimized 40 wt% CuGa2 formulation undergoes a rheological transition into a thixotropic paste, establishing an internal percolation network while maintaining high electrical conductivity and excellent interfacial conformability. Systematic evaluations reveal that the MEIM significantly outperforms conventional OEIMs and unfilled joints. Under a 1.6 N·m clamping torque, the MEIM reduces the static contact resistance of graphite–graphite (C–C) and graphite–copper (C–Cu) joints by 15.3% and 13.0%, respectively, compared to unfilled baselines. At a 20 A DC current, the steady-state temperature at the C–MEIM–C joint is approximately 7 °C lower than that at the C–OEIM–C joint, and the steady-state temperature of the C–MEIM–Cu joint is approximately 6 °C lower than that of the C–OEIM–Cu joint. Furthermore, in dynamic current-carrying sliding tests, the MEIM-coated interface demonstrates exceptional stability, maintaining a contact resistance below 0.1 Ω with negligible fluctuations, in stark contrast to the erratic surges (~ 1.3 Ω) observed during dry sliding. By combining internal metallic bonding with interfacial physical adhesion, the MEIM ensures continuous, low-resistance pathways. This advantage highlights its substantial potential as a reliable alternative to OEIMs for high-power-density and long-life electrical interconnections.