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<p>Meniscus-Confined Electrodeposition (MCED) has emerged as a research hotspot in the field of micro/nano manufacturing owing to its outstanding printing performance, multi-material compatibility, and low-cost characteristics. However, the widespread adoption of MCED is still hindered due to the low deposition efficiency and structural instability of the meniscus formed at the contact between the probe tip and the substrate. Therefore, this paper proposes a temperature field-assisted control method for micro/nanostructure electrodeposition. Firstly, an MCED simulation model is established to analyze the effects of substrate temperature changes on meniscus con-centration and ion current, as well as the key factors influencing the stability of the MCED process. Secondly, the substrate heating technology (with NTC temperature sensors employed for continuous monitoring of the substrate temperature) is employed to indirectly adjust the meniscus temperature, so as to investigate the influence mechanism of substrate heating on the deposition rate. Finally, by controlling the substrate temperature, large-angle tilted micropillars and micro-thermocouple sensor structures are stably and rapidly fabricated. Experimental results show that the temperature field-assisted control method can effectively improve the deposition rate and stability of MCED: the deposition rate at a substrate temperature of 60&#xa0;°C is 118.6% higher than that at 20&#xa0;°C; the maximum tilt angle of copper micropillars at 40&#xa0;°C is 165% higher than that under the 25&#xa0;°C working condition. The proposal of this method will accelerate the application of MCED in the fabrication of micro/nano-scale structures and their corresponding sensors.</p>

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Temperature field-assisted control method for meniscus-confined electrodeposition

  • 期刊论文

  • 发表日期：

    2026年3月23日

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  • Linxiao Teng,
  • Xiaobo Liao,
  • Long Chen,
  • Xuan Liao,
  • Jian Zhuang,
  • Lei Cheng,
  • Jiaxin Yu,
  • Yinghao Wang,
  • Yi Zhou

摘要

Meniscus-Confined Electrodeposition (MCED) has emerged as a research hotspot in the field of micro/nano manufacturing owing to its outstanding printing performance, multi-material compatibility, and low-cost characteristics. However, the widespread adoption of MCED is still hindered due to the low deposition efficiency and structural instability of the meniscus formed at the contact between the probe tip and the substrate. Therefore, this paper proposes a temperature field-assisted control method for micro/nanostructure electrodeposition. Firstly, an MCED simulation model is established to analyze the effects of substrate temperature changes on meniscus con-centration and ion current, as well as the key factors influencing the stability of the MCED process. Secondly, the substrate heating technology (with NTC temperature sensors employed for continuous monitoring of the substrate temperature) is employed to indirectly adjust the meniscus temperature, so as to investigate the influence mechanism of substrate heating on the deposition rate. Finally, by controlling the substrate temperature, large-angle tilted micropillars and micro-thermocouple sensor structures are stably and rapidly fabricated. Experimental results show that the temperature field-assisted control method can effectively improve the deposition rate and stability of MCED: the deposition rate at a substrate temperature of 60 °C is 118.6% higher than that at 20 °C; the maximum tilt angle of copper micropillars at 40 °C is 165% higher than that under the 25 °C working condition. The proposal of this method will accelerate the application of MCED in the fabrication of micro/nano-scale structures and their corresponding sensors.